SFM-137-02-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-137-02-L-D-A-K is a 74-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount PCB assembly. It provides 74 circuits across two rows for high-density board-to-board interconnect in telecom, industrial, and embedded computing designs. Available globally with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- SFM-137-02-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-137-02-L-D-A-K?
- 74-position dual-row socket strip at 0.050" (1.27 mm) pitch for high-density board-to-board connectivity with 74 signal circuits
- Surface mount (SMT) package designed for reflow soldering and automated pick-and-place assembly, minimizing PCB drilling cost
- High-reliability gold-plated contacts rated for extended mating cycles and operating temperatures from -55°C to +125°C
What is SFM-137-02-L-D-A-K used for?
The SFM-137-02-L-D-A-K is deployed in high-density FPGA mezzanine cards, data acquisition daughter boards, and telecom line cards requiring 74 signal lines between PCBs at 1.27 mm pitch. Its 74-position layout at 0.050-inch pitch is used in industrial network controllers and embedded computing modules where a large number of mixed signals must be routed compactly. Engineers also specify it for rugged defense and test instrumentation boards requiring reliable fine-pitch board stacking.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-137-02-L-D-A-K datasheet?
SFM-137-02-L-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-137-02-L-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many circuits and what pitch does the SFM-137-02-L-D-A-K provide for high-density interconnect designs?
The SFM-137-02-L-D-A-K provides 74 circuits in a dual-row configuration at 0.050-inch (1.27 mm) pitch. This places 37 contacts per row at 1.27 mm spacing, making the connector suitable for designs needing to transfer 74 independent signal or power lines between PCBs within a compact footprint roughly 47 mm in total contact length.
When is SFM-137-02-L-D-A-K preferred over an 80-position SFM-140 variant in a board stacking design?
The 74-position SFM-137-02-L-D-A-K is selected when the design has exactly 74 required signal circuits and using an 80-position connector would leave 6 unused pins, unnecessarily increasing footprint and cost. In constrained board areas where every millimeter of edge space matters at 1.27 mm pitch, the exact-count 74-position variant avoids wasted routing channels and slightly reduces the connector's overall occupied PCB length.
What reflow soldering requirements apply to the surface mount SFM-137-02-L-D-A-K?
The SFM-137-02-L-D-A-K uses a standard surface mount (SMT) footprint compatible with lead-free reflow soldering at a peak temperature of up to 260°C per JEDEC J-STD-020 requirements. Its 74-position dual-row pad pattern supports automated paste printing and pick-and-place placement, enabling assembly alongside other SMT components in a single reflow pass without manual soldering.
Is the SFM-137-02-L-D-A-K suitable for high-speed digital signals across 74 positions?
Yes, SAMTEC SFM series connectors at 1.27 mm pitch are characterized for high-speed signal performance and can support data rates up to several Gbps per channel depending on the mated pair geometry and PCB stack-up. The 74-position dual-row layout is suitable for FPGA I/O buses, DDR memory interfaces, and high-speed parallel data transfers where signal integrity across all 74 circuits is critical.
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