SFM-136-T2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-136-T2-H-D-A-K is a 72-position dual-row high-reliability surface mount socket strip with 1.27 mm (0.050") pitch, high-profile (H) standoff, and an integrated keying peg. It features gold-plated spring contacts rated at 1 A per pin for secure, repeatable mating. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- SFM-136-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row socket on a 1.27 mm (0.050") pitch provides high contact density in a compact SMT footprint
- High-profile (H) standoff option creates controlled board-to-board spacing for component clearance in stacked PCB assemblies
- Integrated keying peg (K option) prevents 180-degree mating errors on multi-connector boards
- Gold-plated spring contacts rated at 1 A per pin ensure stable, low-resistance connections over hundreds of mating cycles
Applications
SFM-136-T2-H-D-A-K is designed for mezzanine board stacking applications in FPGA development platforms, high-speed data acquisition systems, and compact RF modules where 72 signals must be routed reliably on a 1.27 mm pitch. The high-profile standoff provides clearance for components or thermal solutions mounted between stacked boards, making it a practical choice for multi-layer embedded computing architectures. The keying peg eliminates orientation errors in systems with multiple identical connectors, reducing field assembly mistakes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the 'H' standoff option provide in SFM-136-T2-H-D-A-K, and why is it useful in stacked PCB designs?
The 'H' designator in SFM-136-T2-H-D-A-K indicates a high-profile standoff that increases the board-to-board separation beyond the standard clearance. This additional height accommodates tall SMT components, heat sinks, or shielding cans mounted between the two boards, which is essential in FPGA mezzanine and RF module stacking applications where component clearance is a primary design constraint on 1.27 mm pitch interfaces.
How many contact positions does SFM-136-T2-H-D-A-K provide, and what current does each pin support?
SFM-136-T2-H-D-A-K provides 72 contact positions in a dual-row 1.27 mm (0.050 inch) pitch arrangement, with each spring contact rated at approximately 1 A. For higher current requirements, multiple pins can be wired in parallel; 6 pins combined deliver up to 6 A, leaving the remaining 66 contacts available for signal routing in mixed-function mezzanine connectors.
When should a designer choose SFM-136-T2-H-D-A-K over an equivalent 2.54 mm pitch socket strip for a 72-position interface?
SFM-136-T2-H-D-A-K at 1.27 mm pitch is the better choice when PCB area is limited and the design uses a fine-pitch routing grid, since the connector body is roughly half the footprint of a 2.54 mm pitch 72-position alternative. It is also preferable when the mating header is already specified at 1.27 mm pitch, as is common on FPGA mezzanine cards and compact embedded modules where the 0.050 inch pitch is the system-level standard.
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