SFM-136-L2-S-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-136-L2-S-D-A-K-TR is a 72-position dual-row high-reliability socket strip at 0.050" pitch for surface mount board interconnects. Its fine-pitch design supports high-density mezzanine and daughter card interfaces with tape-and-reel packaging for automated SMT production. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- SFM-136-L2-S-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row socket strip at 0.050" pitch for ultra-high-density SMT mezzanine and board-stacking applications
- High-reliability socket contacts engineered for repeated mating cycles with consistent low-resistance performance across all 72 positions
- Tape-and-reel packaging enabling automated pick-and-place SMT assembly for medium and high volume production runs
Applications
The SFM-136-L2-S-D-A-K-TR is designed for high-density mezzanine interconnects in FPGA development boards, high-speed data acquisition systems, and compact embedded computing modules that require 72 signal paths at 0.050" pitch. Its surface mount footprint and fine-pitch dual-row layout support low-profile board stacking while the tape-and-reel format ensures compatibility with automated assembly equipment in production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of the SFM-136-L2-S-D-A-K-TR compare to 0.100" pitch socket strips for a 72-position FPGA expansion interface?
The 0.050" (1.27 mm) pitch of the SFM-136-L2-S-D-A-K-TR requires roughly half the board length of a 0.100" pitch equivalent to accommodate 72 positions, freeing significant PCB area for decoupling capacitors or high-speed signal routing near the FPGA. This matters on compact FPGA boards where connector footprints routinely compete with BGA fan-out zones.
What high-reliability design features make the SFM-136-L2-S-D-A-K-TR suitable for repeated mating in test and measurement equipment?
The SFM-136-L2-S-D-A-K-TR is rated as a high-reliability socket strip, meaning the contact design maintains consistent insertion force and low contact resistance across many engagement cycles — typically hundreds to thousands of mates. For automated test fixtures that dock and undock a 72-position device under test board repeatedly during production testing, this durability reduces connector replacement frequency and lowers long-term fixture maintenance cost.
When selecting between SFM-136-L2-S-D-A-K-TR and a board-to-board connector at 0.080" pitch for a new data acquisition module, which design factors favor the finer pitch?
The 0.050" pitch SFM-136-L2-S-D-A-K-TR is preferable when 72 signals must pass through a connector in the smallest possible board length, or when the mating board uses an existing 0.050" pitch header that sets the interface standard. A 0.080" pitch alternative would require a longer connector body and may introduce more stub capacitance per contact at differential signal rates above 500 Mbps.
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