SFM-136-L2-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-136-L2-L-D-A-P-TR is a 72-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch in surface mount configuration. Features L2 solder tail, gold-plated contacts, and tape-and-reel packaging for automated high-volume SMT assembly. Available from authorized distributors worldwide with fast delivery.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- SFM-136-L2-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row SMT socket strip at 0.050" (1.27 mm) pitch delivering 72 high-density signal channels in a compact PCB footprint suitable for mezzanine card interconnects
- Gold-plated contacts (A suffix) with L2 SMT solder tails rated for reflow soldering at up to 260°C and supporting over 500 mating cycles with contact resistance below 20 mΩ
- Tape-and-reel (TR) packaging enabling automated pick-and-place SMT assembly, reducing placement errors and supporting high-throughput manufacturing lines
Applications
The SAMTEC SFM-136-L2-L-D-A-P-TR high-reliability socket strip is designed for high-density board-to-board and mezzanine interconnects in FPGA development boards, test and measurement systems, and high-speed data acquisition equipment. Its 72-position dual-row layout at 0.050" pitch supports dense signal routing in compact modules including FMC-compliant mezzanine cards and radar signal processing boards. This connector is specified in aerospace, defence, and medical imaging applications requiring gold-contact reliability and SMT compatibility for automated assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What signal capacity and pitch does SFM-136-L2-L-D-A-P-TR provide for mezzanine card designs?
The SFM-136-L2-L-D-A-P-TR provides 72 signal positions in a dual-row layout at 0.050" (1.27 mm) pitch, fitting a PCB footprint of approximately 46.4 mm length. This density suits FMC mezzanine card designs compliant with VITA 57.1, embedded computing modules, and high-speed signal processing boards requiring many parallel signal channels within limited board area.
How does the L2 solder tail variant of SFM-136 differ from T2 tails in terms of SMT assembly requirements?
The L2 solder tail on SFM-136-L2-L-D-A-P-TR provides a longer lead length compared to T2 tails, accommodating slightly thicker PCB solder mask clearances and improving solder joint robustness during reflow at up to 260°C. L2 tails suit designs where additional solder fillet height is needed for mechanical reliability, particularly on boards experiencing thermal cycling from -40°C to +85°C in industrial or aerospace applications.
Why is tape-and-reel packaging important for SFM-136-L2-L-D-A-P-TR in high-volume production environments?
Tape-and-reel (TR) packaging for SFM-136-L2-L-D-A-P-TR ensures each connector is individually pocketed in carrier tape on standard reels, enabling automated SMT pick-and-place feeders to place parts accurately at rates exceeding 10,000 placements per hour. This eliminates manual handling of the 72-position dual-row socket strip and reduces misalignment errors that could damage the 1.27 mm pitch contact array during high-volume PCB assembly.
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