SFM-136-L2-L-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-136-L2-L-D-A-P is a 72-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch and surface mount termination, offering gold-plated contacts and secure mating for dense board-to-board interconnect designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- SFM-136-L2-L-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72 positions in dual-row configuration at 0.050" (1.27 mm) pitch for high-density PCB layouts
- High-reliability socket strip design with gold-plated contacts for low-contact-resistance performance
- Surface mount termination compatible with standard SMT reflow soldering
- Dual-row arrangement minimizes footprint while maximizing pin count
- Suitable for high-cycle mating applications requiring consistent insertion and extraction force
- RoHS-compliant lead-free construction for modern manufacturing compliance
Applications
The SFM-136-L2-L-D-A-P is ideal for high-density board-to-board interconnection, FPGA mezzanine cards, and modular embedded computing platforms that require reliable 72-position socket connectivity at 0.050" pitch. It serves applications in telecommunications equipment, industrial automation, and medical instrumentation where compact, high-pin-count surface mount sockets are essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of SFM-136-L2-L-D-A-P compare to standard 0.100" connectors for high-density layouts?
The SFM-136-L2-L-D-A-P uses a 0.050" (1.27 mm) pitch, which is half the spacing of standard 0.100" connectors. This finer pitch allows designers to fit 72 dual-row positions in significantly less PCB area, making it ideal for space-constrained high-density interconnect designs.
Which types of embedded computing or mezzanine designs benefit most from this 72-position socket strip?
Applications such as FPGA mezzanine cards, COM Express modules, and multi-board stacking systems benefit from this 72-position dual-row socket at 0.050" pitch. It provides 72 signal and power connections in a compact SMT footprint, supporting data rates typical of modern embedded computing designs.
Does the SFM-136-L2-L-D-A-P support automated SMT assembly, and what packaging options are available?
Yes, the surface mount (SM) termination style supports automated SMT reflow assembly. The connector mates with SAMTEC's corresponding header series at 0.050" pitch, and availability in standard tray or reel formats supports both prototyping and high-volume production with 72-position dual-row placement.
What should procurement engineers consider when qualifying the SFM-136-L2-L-D-A-P for a new design?
Engineers should verify the mating connector compatibility with SAMTEC's TSM or TSW series at 0.050" pitch, confirm the 72-position dual-row footprint fits the PCB layout, and check RoHS compliance documentation. Lead times for specialty SAMTEC socket strips can run 4 to 12 weeks, so early procurement planning is recommended.
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