SFM-136-02-H-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-136-02-H-D-A-K-TR is a 72-position, dual-row, high-reliability socket strip on a 0.050" (1.27 mm) pitch for surface mount board-to-board stacking applications. Gold-plated contacts and a fine-pitch dual-row layout enable dense, high-integrity signal routing in compact SMT designs. Available on tape and reel for automated assembly with worldwide distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- SFM-136-02-H-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row 0.050" (1.27 mm) pitch socket strip for extremely high-density SMT board-to-board interconnect
- Gold contact finish (K suffix) delivers contact resistance below 20 milliohms and corrosion resistance across thousands of mating cycles for high-reliability applications
- Tape and reel (TR) delivery with SMT footprint for automated pick-and-place integration on high-volume production lines
Applications
The SFM-136-02-H-D-A-K-TR is ideal for FPGA mezzanine cards, high-speed digital daughter boards, and RF module stacks where 72 contacts on a 0.050 inch pitch are needed to maximize signal density within a constrained board footprint. Its high-reliability gold contacts suit demanding environments in defense electronics, aerospace payload boards, and medical imaging systems where long-term contact integrity across hundreds of mating cycles is mandatory.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of the SFM-136-02-H-D-A-K-TR enable higher density than standard 0.100" pitch alternatives for a 72-pin interface?
At a 0.050 inch (1.27 mm) pitch, the SFM-136-02-H-D-A-K-TR fits 72 contacts into a dual-row footprint roughly 46 mm long and 3.5 mm wide between row centers. An equivalent 72-position connector at 0.100 inch pitch would span approximately 92 mm in length — doubling the board area consumed — making the fine-pitch SFM a necessary choice for compact modules where PCB length is constrained below 50 mm.
In a defense electronics stack requiring verified mating-cycle reliability, what does the K suffix gold contact finish provide?
The K suffix designates gold plating on the SFM-136-02-H-D-A-K-TR contacts, which maintains contact resistance below 20 milliohms even after 500 or more mating cycles. Gold resists oxidation and fretting corrosion that would degrade tin-plated contacts in vibration-prone military or aerospace environments, making it the required finish for MIL-spec board-to-board connectors used in radar, avionics, and satellite payloads.
What current capacity should a designer assume per pin when routing power signals through the SFM-136-02-H-D-A-K-TR?
Fine-pitch 0.050 inch connectors in the SFM family are rated for approximately 1 A per contact for signal use, though designers routing 3.3 V or 5 V power rails should derate to 0.5 A per pin in high-ambient-temperature environments above 70°C. For a 72-position dual-row socket, bundling 4 to 6 adjacent pins per power net provides 2 A to 3 A capacity while keeping per-pin current within thermal limits, a standard practice in FPGA mezzanine card power distribution.
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