SFM-136-02-F-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-136-02-F-D-A-P is a 72-position, dual-row, high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface mount assembly. Providing 144 total contacts in a fine-pitch dual-row layout, it is designed for high-density mezzanine board sockets, FPGA expansion interfaces, and communications backplane applications requiring compact, reliable interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- SFM-136-02-F-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row configuration with 1.27 mm (0.050 inch) pitch for high-density PCB interconnect
- High-reliability socket strip construction with gold-plated contacts for long mating cycle life
- Surface mount termination compatible with standard lead-free SMT reflow assembly processes
- Fine-pitch dual-row layout provides 144 signal contacts in a compact board footprint
- SAMTEC SFM high-reliability series rated for industrial and communications equipment environments
Applications
The SFM-136-02-F-D-A-P is commonly deployed in mezzanine board interconnects, FPGA daughtercard sockets, and telecom line card assemblies where 72 dual-row positions at 1.27 mm pitch deliver high signal density in a small PCB footprint. It is well-suited for industrial computing, test and measurement equipment, and communications infrastructure modules requiring high-reliability fine-pitch socket connections. The surface mount design supports automated PCB assembly and enables reliable field-replaceable module architectures.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contacts does the SFM-136-02-F-D-A-P provide at its 0.050 inch pitch?
The SFM-136-02-F-D-A-P is a 72-position dual-row socket strip at 1.27 mm (0.050 inch) pitch, providing 144 total contacts. This fine-pitch dual-row configuration enables high signal density in compact mezzanine and daughtercard interconnect applications where board space is limited to less than 50 mm in connector length.
What reflow profile is compatible with the SFM-136-02-F-D-A-P surface mount termination?
The SFM-136-02-F-D-A-P uses surface mount termination compatible with standard lead-free SMT reflow processes, including peak reflow temperatures up to 260°C per IPC J-STD-020. This makes it suitable for RoHS-compliant manufacturing lines in industrial, communications, and computing PCB assembly environments.
In what industrial and communications designs is the SFM-136-02-F-D-A-P most commonly specified?
This 72-position socket strip is frequently used in FPGA expansion cards, telecom line card mezzanine sockets, and industrial backplane assemblies. Its 144 contacts at 1.27 mm pitch support high-bandwidth parallel bus interfaces, and the dual-row surface mount footprint fits board-to-board stacking heights typically ranging from 5 mm to 15 mm.
How does the SFM-136-02-F-D-A-P compare to 0.100 inch pitch connectors for high-density designs?
Compared to standard 0.100 inch (2.54 mm) pitch socket strips, the SFM-136-02-F-D-A-P with 1.27 mm pitch fits the same 144 contacts into roughly half the PCB footprint area. This makes it the preferred choice for designs requiring more than 100 signal connections within a 45 mm connector length, such as high-speed data acquisition and FPGA-based processing boards.
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