SFM-135-T2-H-D-A-K SAMTEC Connector (Other) In Stock
SFM-135-T2-H-D-A-K is a high-reliability 70-position dual-row SMT socket strip from Samtec with 0.050" (1.27 mm) pitch and vertical through-hole-compatible footprint, delivering 35 positions per row for dense daughter-card interconnection in demanding electronics.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- SFM-135-T2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70 positions at 0.050" (1.27 mm) pitch in a dual-row vertical SMT configuration, providing 35 signal connections per row for high-density FPGA and DSP mezzanine card interfaces
- High-reliability socket with gold-plated contacts rated for extended mating cycles, ensuring consistent low-resistance contact in field-replaceable module designs
- Vertical (T2) surface mount termination compatible with standard reflow soldering, enabling automated assembly while maintaining controlled 50-ohm impedance across all 70 positions
Applications
SFM-135-T2-H-D-A-K is used in FPGA mezzanine, FMC-style, and expansion daughter card interconnects in defense electronics, communications infrastructure, and industrial embedded computing. The 70-position, 0.050" pitch dual-row socket supports up to 35 differential pairs for high-speed serial interfaces such as LVDS and SERDES between a carrier board and plugin module. Its high-reliability gold contacts and SMT footprint suit production boards requiring consistent solder joint quality across hundreds of units.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many differential pairs can SFM-135-T2-H-D-A-K support in a high-speed mezzanine interface?
SFM-135-T2-H-D-A-K provides 70 total positions in a dual-row 0.050" (1.27 mm) pitch layout, accommodating up to 35 differential pairs per connector. This capacity is sufficient for LVDS video data buses, multi-lane SERDES links, and FPGA I/O banks running at data rates from hundreds of Mbps to several Gbps per pair in daughter card applications.
What makes the SFM-135-T2-H-D-A-K suitable for field-serviceable modular electronics systems?
The high-reliability gold-plated contacts of SFM-135-T2-H-D-A-K are rated for repeated mating cycles, allowing daughter cards to be swapped without connector degradation across the 70 positions. This durability is essential for test equipment, communications line cards, and defense systems where modules must be replaced in the field at least 50 to 100 times over the product service life.
How does SFM-135-T2-H-D-A-K compare to a 0.100" pitch socket strip of similar position count in board space usage?
SFM-135-T2-H-D-A-K at 0.050" (1.27 mm) pitch occupies roughly half the board length of a standard 0.100" (2.54 mm) pitch 70-position dual-row socket, reducing connector footprint from approximately 89 mm to 44 mm for the 35-per-row configuration. This space saving is critical on compact mezzanine cards where PCB area for the connector interface must remain below 50 mm in length.
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