SFM-135-L2-SM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-135-L2-SM-D-A-K is a 70-position, dual-row, high-reliability surface-mount socket strip with 0.050-inch pitch and gold-plated contacts, designed for precision high-density board-to-board interconnects. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- SFM-135-L2-SM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position dual-row SMT socket with 0.050-inch (1.27 mm) pitch enabling ultra-high-density board-to-board signal routing on compact PCBs
- Gold-plated (A) contacts ensure stable low contact resistance across hundreds of mating cycles for high-reliability applications
- High-reliability SAMTEC construction with tight dimensional tolerances for consistent insertion force and signal integrity in demanding environments
Applications
The SFM-135-L2-SM-D-A-K is suited for high-density mezzanine card interfaces, FPGA daughter boards, and communications module assemblies where 70 signal connections must be routed within a minimal PCB footprint. Its 0.050-inch pitch allows twice the contact density of standard 2.54 mm headers, enabling compact stacking designs in telecom line cards and embedded computing platforms. The gold-plated contacts support repeated mating in test fixtures and field-replaceable module applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and total position count of the SFM-135-L2-SM-D-A-K?
The SFM-135-L2-SM-D-A-K has 70 positions arranged in 2 rows of 35 contacts each, with a 0.050-inch (1.27 mm) pitch. This tight spacing allows over 27 contacts per linear inch, making it suitable for high-pin-count mezzanine card and FPGA daughter board applications.
How does the gold plating on SFM-135-L2-SM-D-A-K contacts improve reliability in repeated-mate applications?
Gold plating (denoted by the A suffix) maintains contact resistance below 20 mΩ after hundreds of mating cycles by preventing surface oxidation. This is critical in test fixture and field-replaceable module applications where tin-plated contacts would develop oxide layers that increase resistance and cause intermittent connections after as few as 50 insertions.
Which mating header series is compatible with the SFM-135-L2-SM-D-A-K for a complete board-stack assembly?
The SFM-135 series mates with SAMTEC's TSM and SFM plug header series that share the 0.050-inch (1.27 mm) pitch dual-row format. Selecting a mating header with a matched stack height between 8 mm and 20 mm allows designers to set the board separation in their stacked PCB assembly, accommodating through-components or thermal management features between boards.
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