SFM-135-L2-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-135-L2-H-D-A-K is a 70-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch and L2 extended solder tail for high-reliability board-to-board interconnection. Gold-plated contacts and H high-profile stack height accommodate module socket applications requiring additional clearance. Available from authorized distributors worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- SFM-135-L2-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position dual-row layout on 0.050" (1.27 mm) pitch delivers 70 independent signal or power contacts in a compact SMT footprint
- L2 extended solder tail increases through-board retention strength for connectors subject to mechanical stress during mating cycles
- H high-profile stack height provides additional board-to-board clearance, accommodating taller components on the mating daughter card
Applications
The SFM-135-L2-H-D-A-K is used in FPGA daughter-card sockets, DSP module interfaces, and high-density embedded computing boards requiring 70-pin dual-row connectivity with elevated stacking clearance. Its extended L2 tail improves solder joint integrity in applications subject to vibration or repeated mating, such as industrial automation controllers and ruggedized test equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the L2 tail option on the SFM-135-L2-H-D-A-K mean for PCB solder joint strength?
The L2 designation specifies an extended solder tail length compared to the standard L tail, increasing the solder fillet area on the PCB pad for each of the 70 contacts. This extended tail improves pull strength by roughly 20% in shear loading, which is critical in vibration-prone industrial applications where standard-tail connectors may experience solder joint fatigue.
How does the H stack height of SFM-135-L2-H-D-A-K benefit daughter-card assemblies with tall components?
The H (high) profile option raises the mating board engagement point, providing several extra millimeters of clearance between the two PCBs compared to the standard-height SFM variant. This allows tall capacitors or inductors up to 8 mm in height on the daughter card to clear the mother board surface when the 70-position dual-row connector is fully mated.
For a 70-signal FPGA expansion interface, how does the SFM-135-L2-H-D-A-K compare to a 2.54 mm pitch alternative?
The SFM-135-L2-H-D-A-K's 0.050" (1.27 mm) pitch reduces the connector length to approximately 45 mm for 70 dual-row positions, compared to roughly 90 mm for a 2.54 mm pitch connector carrying the same 70 signals. This 50% length reduction frees significant PCB real estate in compact FPGA expansion designs while maintaining 1 A per contact current rating.
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