SFM-135-L2-F-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-135-L2-F-D-A-K is a 70-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, providing high-reliability board-to-board connectivity for space-constrained PCB designs. Engineered for demanding applications requiring consistent performance across extended mating cycles.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- SFM-135-L2-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position dual-row SMT socket at 0.050" (1.27 mm) pitch enabling high-density board-to-board signal routing
- High-reliability SAMTEC contact system with precision machined contacts rated for repeated insertion cycles in industrial-grade applications
- Surface mount construction with low-profile design simplifies multi-layer PCB assembly and reduces board stack-up height
Applications
The SFM-135-L2-F-D-A-K is ideal for FPGA daughter cards, industrial compute modules, and communications boards where 70 signal connections must be routed in the smallest possible connector footprint. Its 0.050" pitch dual-row layout achieves higher signal density than standard 0.100" alternatives, making it a preferred solution for engineers designing high-channel-count interfaces on compact multi-layer PCBs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch configuration does the SAMTEC SFM-135-L2-F-D-A-K provide?
The SFM-135-L2-F-D-A-K provides 70 positions arranged in a dual-row layout at a 0.050" (1.27 mm) pitch, giving 35 contacts per row. This configuration supports 70-signal parallel interfaces common in FPGA I/O banks, digital signal processor boards, and multi-channel sensor acquisition modules.
When should a designer choose the SFM-135-L2-F-D-A-K over a 0.100" pitch dual-row socket for a 70-position interface?
When PCB area is constrained and a 70-position interface must fit within a compact outline, the SFM-135-L2-F-D-A-K at 0.050" (1.27 mm) pitch halves the connector length versus a 0.100" pitch equivalent. This is critical on FPGA mezzanine boards and mini-PCIe expansion cards where connector length directly limits the usable logic or memory area on the host board.
What SMT assembly process is recommended for soldering the SFM-135-L2-F-D-A-K, and are there any pad layout considerations?
The SFM-135-L2-F-D-A-K is designed for standard lead-free SMT reflow soldering at peak temperatures up to approximately 260°C. At 0.050" (1.27 mm) pitch with a 70-position dual-row pattern, precise solder paste stencil design with 0.125 mm aperture tolerances is recommended to prevent bridging between adjacent pads and ensure uniform joint formation across all 70 positions.
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