SFM-134-T2-H-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-134-T2-H-D-LC-TR is a 68-position dual-row high-reliability surface mount socket strip with 0.050" pitch, featuring T2 tail style, H height, and LC latch clip for secure mating retention. Designed for fine-pitch high-cycle applications in compact SMT assemblies. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Datasheet
- SFM-134-T2-H-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-134-T2-H-D-LC-TR?
- 68 positions at 0.050" (1.27 mm) dual-row pitch enabling high-density signal routing in a compact SMT footprint
- LC (latch clip) retention mechanism provides positive mating engagement and withstands vibration and shock up to 20 G
- T2 tail style optimized for surface mount reflow at up to 260°C, ensuring reliable solder joints across all 68 contacts
- High-reliability socket strip construction rated for thermal cycling from -55°C to +125°C in demanding environments
What is SFM-134-T2-H-D-LC-TR used for?
The SFM-134-T2-H-D-LC-TR is ideal for mezzanine card interconnects in FPGA development boards, communications blades, and high-speed test systems where 68 contacts at 0.050" pitch must withstand repeated mating cycles and mechanical stress. The latch clip retention makes it well-suited for field-replaceable plug-in modules in industrial rack systems and aerospace line-replaceable units. Tape-and-reel packaging enables high-volume automated SMT assembly in telecommunications and defense electronics production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-134-T2-H-D-LC-TR datasheet?
SFM-134-T2-H-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-134-T2-H-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the LC latch clip on SFM-134-T2-H-D-LC-TR contribute to connector retention performance?
The LC latch clip on SFM-134-T2-H-D-LC-TR provides a positive mechanical lock that resists unmating forces caused by vibration, shock loads up to 20 G, and cable tension. This retention feature is critical in airborne and vehicle-mounted electronics where unplugged connectors during operation can cause system failure. The latch releases with a defined actuation force, enabling controlled disconnection without damaging the 68-position fine-pitch contact array.
How does SFM-134-T2-H-D-LC-TR perform across the temperature range encountered in industrial and aerospace designs?
SFM-134-T2-H-D-LC-TR is rated for operation across a temperature range of -55°C to +125°C, encompassing industrial grade and MIL-SPEC aerospace requirements. At both temperature extremes the high-reliability contact spring design maintains consistent contact force above 50 grams, preventing intermittent opens caused by differential thermal expansion of the PCB laminate and connector body materials during thermal cycling.
For a dual mezzanine design, how does the 68-pin count of SFM-134-T2-H-D-LC-TR align with common FPGA I/O bank configurations?
A 68-pin dual-row connector at 0.050" pitch maps directly to a single FPGA I/O bank of 32 to 34 differential pairs plus ground and power pins, covering standard LVDS interface widths of 16, 24, or 32 pairs. Two SFM-134-T2-H-D-LC-TR connectors placed in parallel can support 136 pins, which is sufficient for PCIe x8 Gen 3 lane routing with auxiliary management signals on a compact FPGA mezzanine board.
Is SFM-134-T2-H-D-LC-TR available in tape-and-reel format and what production volume does that support?
Yes, the TR suffix confirms tape-and-reel packaging on 12 mm or 16 mm carrier tape. This format supports automated pick-and-place placement at rates exceeding 3,000 fine-pitch components per hour, enabling cost-effective production from 500 to over 50,000 units annually. The consistent orientation in the carrier tape eliminates manual pre-staging and reduces placement defect rates by more than 90% compared to tray packaging for 0.050" pitch SMT connectors.
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