SFM-134-02-LM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-134-02-LM-D-LC-TR is a 68-position, dual-row, 0.050" pitch high-reliability surface-mount socket strip with low-clearance profile and tape-and-reel packaging, suited for slim high-density board-to-board stacking.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Datasheet
- SFM-134-02-LM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-134-02-LM-D-LC-TR?
- 68-position dual-row surface-mount socket at 0.050" (1.27 mm) pitch provides high signal channel density for FPGA mezzanine, backplane, and processor module interconnects
- Low-clearance (LC) profile minimises the mated board-to-board separation height, enabling thinner system assemblies in space-constrained enclosures
- Tape-and-reel (TR) packaging with LM (lead modification) termination allows automated SMT pick-and-place assembly and optimised solder joint geometry on fine-pitch pads
What is SFM-134-02-LM-D-LC-TR used for?
The SFM-134-02-LM-D-LC-TR is used in high-density board-to-board stacking configurations for FPGA mezzanine cards, embedded computing modules, and compact telecom line cards requiring 68 dual-row contacts at 0.050" pitch with a minimised mated height. Its low-clearance profile makes it a preferred socket choice for slim-form-factor ruggedized computers, medical imaging boards, and portable defense electronics where both signal density and vertical space constraints must be satisfied simultaneously.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-134-02-LM-D-LC-TR datasheet?
SFM-134-02-LM-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-134-02-LM-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the low-clearance (LC) profile of the SFM-134-02-LM-D-LC-TR mean for the mated height between two stacked PCBs?
The low-clearance designation means the SFM-134-02-LM-D-LC-TR is manufactured to achieve a reduced board-to-board separation when mated with its complementary header. Compared to standard-profile 0.050" pitch sockets, the LC variant lowers the total stack height by several tenths of a millimetre, which is significant in slim embedded systems where the overall PCB-to-PCB clearance budget may be as tight as 3 to 5 mm.
What is the LM (lead modification) termination on the SFM-134-02-LM-D-LC-TR, and how does it affect the SMT solder joint?
The LM designation refers to a modified lead geometry on the 68 dual-row SMT contact tails, typically a coplanarity or offset adjustment that improves pad coverage and solder fillet formation during reflow. This modification compensates for slight height variations across the long 0.050" pitch body, ensuring all 68 contacts achieve adequate solder contact with their PCB pads in a single reflow pass without requiring selective solder touch-up.
For a compact FPGA mezzanine card design using 68 high-speed signals, why would a designer specify the SFM-134-02-LM-D-LC-TR over a 0.100" pitch socket carrying the same channel count?
At 0.050" (1.27 mm) pitch, the SFM-134-02-LM-D-LC-TR places 68 contacts into roughly half the linear board length required by a 0.100" pitch socket of the same count. For a FPGA mezzanine carrying 68 channels of LVDS, LVCMOS, or SerDes signals, the shorter connector reduces trace length mismatches between the outermost and innermost pins, lowers impedance discontinuity risk, and frees PCB area adjacent to the socket for decoupling capacitors or power plane reliefs.
How does the tape-and-reel packaging of the SFM-134-02-LM-D-LC-TR support consistent quality during automated SMT placement of this 68-position connector?
Tape-and-reel packaging orients and positions each SFM-134-02-LM-D-LC-TR in a standardised carrier so the pick-and-place nozzle can locate the connector body precisely for all 68 dual-row contacts at 0.050" pitch. Consistent machine placement prevents the rotational and translational errors that occur with manual or tray-loaded placement, reducing pad-to-lead misalignment and solder bridging defects across high-volume production batches of PCBs with fine-pitch SMT sockets.
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