SFM-134-02-F-D-DS SAMTEC Connector (Other) In Stock
SFM-134-02-F-D-DS is a 68-position dual-row high-reliability surface-mount socket strip on a 1.27 mm (0.050") pitch from SAMTEC, offering vertical termination and dual-shield construction for dense, shielded mezzanine board-to-board interconnects. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- SFM-134-02-F-D-DS Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-134-02-F-D-DS?
- 68 contacts in 2 rows on 1.27 mm (0.050 inch) pitch delivers high-density mezzanine connectivity in a minimal PCB footprint
- Dual-shield (DS) construction provides EMI shielding on both sides of the connector body, reducing crosstalk on adjacent signal pairs
- Vertical (F) SMT termination mates with pin headers perpendicular to the PCB plane for controlled board-to-board stack height
- High-reliability socket design with SAMTEC precision gold contacts rated for low contact resistance below 30 mΩ over hundreds of mating cycles
- Surface-mount solder termination withstands lead-free reflow at up to 260°C peak, enabling automated assembly on standard SMT lines
What is SFM-134-02-F-D-DS used for?
The SFM-134-02-F-D-DS is designed for high-frequency mezzanine and FMC daughter-card interconnects in FPGA development boards, software-defined radio platforms, and radar signal-processing modules where 68 signals — including differential pairs — must pass between boards with minimal EMI coupling. Its dual-shield construction reduces inter-connector crosstalk at data rates above 1 Gbit/s per channel, making it suitable for high-speed digital interfaces such as LVDS and LPDDR. The 1.27 mm pitch also makes it a natural fit for compact military and aerospace avionics modules that follow VITA-57 FMC form-factor guidelines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-134-02-F-D-DS datasheet?
SFM-134-02-F-D-DS Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-134-02-F-D-DS?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the significance of the dual-shield (DS) option on the SFM-134-02-F-D-DS, and when should a designer specify it?
The dual-shield (DS) option adds metal shielding plates on both sides of the 1.27 mm pitch socket body, reducing electromagnetic coupling between the connector and adjacent traces or components. This shielding is particularly important when signals at frequencies above 500 MHz are routed through the connector, as unshielded connectors at that pitch can exhibit crosstalk levels of -20 dB or worse between adjacent pins, whereas the dual-shield version can improve isolation by 10 dB to 15 dB.
How does the 1.27 mm pitch of the SFM-134-02-F-D-DS benefit FPGA mezzanine card designs compared to 2.54 mm pitch connectors?
At 1.27 mm pitch the SFM-134-02-F-D-DS packs 68 contacts into a connector body roughly 22 mm long, while a 2.54 mm pitch connector carrying the same 68 signals would span approximately 44 mm. This 50% length reduction is critical for VITA-57 FMC mezzanine cards, which specify a maximum connector envelope of 40 mm x 10 mm to ensure compatibility with standard FPGA carrier boards from vendors like Xilinx and Intel.
How many mating cycles is the SFM-134-02-F-D-DS rated for, and what contact resistance can be expected?
The SFM-134-02-F-D-DS uses SAMTEC high-reliability contacts rated for a minimum of 200 mating cycles while maintaining contact resistance below 30 mΩ per pin. Gold-plated contact surfaces resist oxidation and fretting corrosion, which is especially important in laboratory equipment and test fixtures where the mezzanine card may be replaced weekly, accumulating 50 or more mating cycles per year over a 4-year instrument lifetime.
Is the SFM-134-02-F-D-DS compatible with standard lead-free reflow profiles, and does it need any special handling during PCB assembly?
Yes — the SMT solder tail termination of the SFM-134-02-F-D-DS is qualified for lead-free reflow at up to 260°C peak temperature, meeting IPC/JEDEC J-STD-020 Class 3 requirements. During assembly, the connector body should be protected from flux splatter on the mating contacts, and a solder paste stencil aperture of 0.5 mm x 0.8 mm per pad is typically specified for the 1.27 mm pitch land pattern to achieve consistent solder joint volume across all 68 positions.
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