SFM-134-02-F-D-A-K SAMTEC Connector (Other) In Stock
The SFM-134-02-F-D-A-K is a 68-position dual-row high-reliability socket strip from SAMTEC with 0.050-inch pitch in a surface-mount package for dense signal interconnect. It is engineered for reliable board-to-board mating in aerospace, defense, and industrial applications requiring high pin density. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 68
- Lifecycle
- ACTIVE
- Datasheet
- SFM-134-02-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 68-position dual-row layout at 0.050-inch (1.27 mm) pitch enables high-density signal routing in compact SMT board-to-board designs
- High-reliability contact system ensures consistent low contact resistance and reliable mating over extended product lifetimes in harsh environments
- Surface-mount termination supports automated SMT assembly for high-volume production without through-hole drilling
Applications
The SFM-134-02-F-D-A-K is designed for mezzanine card, daughter card, and module interconnect applications in aerospace avionics, defense electronics, and industrial computing platforms requiring 68 pins at 0.050-inch pitch. Its high-reliability construction makes it a preferred choice for removable compute modules and FPGA expansion cards where signal integrity across many insertion cycles is mandatory. The connector also suits ruggedized test equipment and mission-critical embedded systems where reliable multi-signal interconnection is essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count and row configuration does the SFM-134-02-F-D-A-K provide for mezzanine card designs?
The SFM-134-02-F-D-A-K offers 68 contact positions in a dual-row configuration at 0.050-inch (1.27 mm) pitch, providing sufficient signal density for mezzanine and daughter card interfaces in compact embedded computing and FPGA module designs where board-to-board connector space is limited.
How does the high-reliability construction of SFM-134-02-F-D-A-K compare to standard socket strips for aerospace use?
Unlike standard commercial socket strips, the SFM-134-02-F-D-A-K is built to high-reliability standards with contact materials and plating selected to maintain low contact resistance and stable mating force over the extended temperature ranges and vibration levels typical of aerospace avionics and defense electronics environments.
What assembly process does SFM-134-02-F-D-A-K support, and how does this affect PCB cost?
The SFM-134-02-F-D-A-K uses surface-mount termination compatible with standard reflow soldering, which eliminates 68 through-holes from the PCB stack-up. This reduces laminate drilling cost, enables denser two-sided component placement, and supports fully automated pick-and-place assembly on high-volume industrial and aerospace PCB production lines.
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