SFM-133-T2-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-T2-L-D-A-P-TR is a 66-position dual-row high-reliability socket strip with 0.050" pitch and low-profile surface mount termination in tape-and-reel packaging. Engineered for compact micro-pitch board-to-board connections requiring dense signal routing. Available from authorized distributors worldwide with global shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-T2-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-133-T2-L-D-A-P-TR?
- 66-position dual-row socket at 0.050" (1.27 mm) pitch supports high signal-count connections in a reduced PCB footprint compared to 0.100" pitch alternatives
- Low-profile (L) design minimizes stack height, ideal for slim form-factor applications where board-to-board clearance is under 3 mm
- Tape-and-reel (TR) packaging ensures compatibility with high-volume automated pick-and-place SMT assembly equipment
What is SFM-133-T2-L-D-A-P-TR used for?
The SFM-133-T2-L-D-A-P-TR is suited for compact embedded systems, portable test instruments, and FPGA evaluation boards that require 66-position dual-row board-to-board connectivity at micro-pitch spacing. The low-profile configuration minimizes the overall assembly height, making it a strong choice for slim industrial panels and handheld devices. Its 0.050" pitch enables twice the connection density of standard 0.100" socket strips in the same board length.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-133-T2-L-D-A-P-TR datasheet?
SFM-133-T2-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-133-T2-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What board-to-board signal count does SFM-133-T2-L-D-A-P-TR provide and at what pitch?
The SFM-133-T2-L-D-A-P-TR provides 66 signal positions arranged in a dual-row format at a 0.050" (1.27 mm) pitch. This micro-pitch layout fits 66 connections into a PCB length that would normally accommodate only 33 positions at a standard 0.100" pitch, making it highly efficient for space-constrained PCB designs.
How does the low-profile (L) designation of SFM-133-T2-L-D-A-P-TR affect stacked PCB assembly height?
The L (low-profile) designation on the SFM-133-T2-L-D-A-P-TR reduces the mated stack height to less than 3 mm above the PCB surface, compared to standard or high-profile variants. This is particularly valuable in slim enclosures and portable electronics where total device thickness is tightly constrained, while still maintaining reliable 66-position dual-row connectivity.
For which high-density signal applications is SFM-133-T2-L-D-A-P-TR a preferred choice over through-hole connectors?
The SFM-133-T2-L-D-A-P-TR is preferred over through-hole connectors in FPGA evaluation boards, high-speed data acquisition modules, and compact industrial controllers because its SMT termination eliminates through-hole drilling and supports fully automated assembly. With 66 positions at 0.050" pitch, it provides a much smaller PCB footprint than equivalent through-hole headers, reducing board cost and enabling finer routing of high-speed differential signal pairs.
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About SAMTEC
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