SFM-133-T2-FM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-T2-FM-D-A-P is a 66-position dual-row high-reliability socket strip with 0.050 inch pitch and flush-mount surface mount termination, providing precise board-to-board interconnects in space-critical embedded and instrumentation applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-T2-FM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66 positions in dual-row 0.050" pitch layout for maximum channel density in compact system designs
- Flush-mount (FM) termination minimizes stand-off height for ultra-low-profile SMT assemblies
- High-reliability socket construction rated for 500+ mating cycles with consistent contact performance
- Anti-wicking contact geometry prevents solder migration during lead-free reflow at 260°C
- Dual-row arrangement supports simultaneous routing of signal, power, and ground pins in one connector
Applications
The SFM-133-T2-FM-D-A-P is ideal for high-channel-count board-to-board connections in FPGA development platforms, network processor cards, and data acquisition systems where 0.050 inch pitch minimizes board footprint. Its flush-mount termination allows extremely low-profile assemblies suited for thin form-factor embedded computing modules. The 66-position dual-row format supports parallel data buses, multi-channel ADC interfaces, and high-speed digital backplane connections in demanding industrial and communications hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does flush-mount termination in SFM-133-T2-FM-D-A-P reduce overall assembly height compared to elevated-mount variants?
Flush-mount (FM) termination places the connector body flush with the PCB surface, reducing stand-off height to approximately 1.0 mm or less compared to 2 mm to 4 mm for elevated-mount socket strips. This is critical in stacked board assemblies where the total board-to-board clearance is limited to under 5 mm, such as in compact embedded computing modules.
Can the 66 contacts of SFM-133-T2-FM-D-A-P support mixed signal and power routing in a single connector?
Yes, the 66 positions across dual rows allow engineers to dedicate specific contacts to power delivery at 1 A per pin and reserve remaining contacts for high-speed digital signals up to 1 GHz. A typical allocation on FPGA mezzanine boards uses 6 contacts for power and ground rails and 60 contacts for parallel data and control signals.
How does SFM-133-T2-FM-D-A-P compare to 0.100 inch pitch alternatives when designing a 66-channel interface?
A 66-position connector at 0.050 inch (1.27 mm) pitch fits within a body length of roughly 1.7 inches, while a comparable 0.100 inch pitch connector would require approximately 3.4 inches. The SFM-133-T2-FM-D-A-P effectively halves the board edge length needed, freeing up space for additional circuitry in a standard 100 mm × 100 mm PCB form factor.
What packaging options are available for SFM-133-T2-FM-D-A-P and how does that affect minimum order quantities?
SAMTEC SFM series high-reliability socket strips are typically available in tray packaging for manual placement or tape-and-reel for automated SMT assembly, with reel quantities of 500 to 1000 pieces. Minimum order quantities at distribution start at 10 to 50 pieces, while production orders from SAMTEC directly may have lead times of 8 to 12 weeks for the 66-position SFM configuration.
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