SFM-133-T2-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-T2-F-D-A-P-TR is a 66-position dual-row high reliability socket strip with 1.27 mm (0.050 inch) pitch, designed for surface mount mezzanine and board stacking applications. Precision stamped contacts ensure consistent signal integrity across all 66 positions and multiple mating cycles. Tape-and-reel packaging enables high-volume automated SMT pick-and-place assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-T2-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-133-T2-F-D-A-P-TR?
- 66-position dual-row socket strip with 1.27 mm (0.050") pitch for dense mezzanine board-stacking interconnect
- High-reliability stamped socket contacts with dual-wipe design for low contact resistance and extended mating life
- Tape-and-reel (TR) packaging compatible with automated SMT pick-and-place equipment for high-volume production
What is SFM-133-T2-F-D-A-P-TR used for?
The SFM-133-T2-F-D-A-P-TR is designed for high-density mezzanine card and daughter board applications in embedded computing, industrial automation, and defense electronics. With 66 positions at 1.27 mm pitch, it supports simultaneous routing of multiple high-speed digital signals and power rails between stacked PCBs in a compact surface mount footprint. The tape-and-reel packaging and surface mount design make it well-suited for automated production of communication modules, FPGA carrier boards, and test equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-133-T2-F-D-A-P-TR datasheet?
SFM-133-T2-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-133-T2-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the position count and pitch of the SFM-133-T2-F-D-A-P-TR connector?
The SFM-133-T2-F-D-A-P-TR features 66 positions arranged in a dual-row configuration with a 1.27 mm (0.050 inch) pitch, providing 33 pins per row. This combination enables dense signal routing in mezzanine stacking designs while maintaining a compact PCB footprint suitable for industrial and embedded computing boards.
Which stacking height does the T2 designation correspond to in SFM-133-T2-F-D-A-P-TR?
In SAMTEC SFM series nomenclature, the T2 designator specifies a defined stacking height, which in the SFM-133-T2 variant provides a specific board separation distance in the mezzanine assembly. This allows engineers designing daughter cards to maintain precise inter-board clearances while routing 66 signal lines at 1.27 mm pitch, accommodating component heights on the daughter card PCB.
How does SFM-133-T2-F-D-A-P-TR compare to a 98-position SFM-149 for FPGA carrier designs?
The SFM-133-T2-F-D-A-P-TR with 66 positions suits FPGA carrier designs requiring fewer I/O lanes, while the 98-position SFM-149 supports denser interconnect. Both use the same 1.27 mm pitch dual-row SFM format, so they share compatible footprint geometry. Choosing the 66-position variant saves PCB space when the design only needs up to 66 signal and power connections between the main board and the FPGA mezzanine card.
Is the SFM-133-T2-F-D-A-P-TR suitable for automated SMT assembly in production environments?
Yes, the SFM-133-T2-F-D-A-P-TR is supplied in tape-and-reel (TR) packaging, making it fully compatible with automated SMT pick-and-place machines. Its surface mount termination is designed for standard reflow soldering processes, and the 1.27 mm pitch requires precise stencil control during solder paste printing to ensure reliable joint formation across all 66 positions in high-volume production runs.
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