SFM-133-L2-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-L2-L-D-A-P-TR is a 66-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch in tape-and-reel packaging. Designed for compact mezzanine and board-to-board stacking with low-profile (L) housing and press-fit (P) mounting. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-L2-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-133-L2-L-D-A-P-TR?
- 66-position dual-row socket at 0.050" (1.27 mm) pitch delivers high signal density while keeping the PCB footprint under 42 mm in length
- Low-profile (L) housing minimizes stack height, enabling board-to-board assemblies with tight vertical clearance requirements
- Tape-and-reel (TR) and press-fit (P) options streamline automated SMT assembly and improve mechanical retention on the PCB
What is SFM-133-L2-L-D-A-P-TR used for?
The SFM-133-L2-L-D-A-P-TR is suited for high-density mezzanine interconnects in embedded computing modules, FPGA carrier boards, and compact RF front-end assemblies requiring 66 reliable signal connections at 0.050" pitch. The combination of low-profile housing and tape-and-reel packaging makes it a production-friendly choice for automated assembly of multi-board stacked PCB systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-133-L2-L-D-A-P-TR datasheet?
SFM-133-L2-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-133-L2-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-133-L2-L-D-A-P-TR support and what pitch does it use?
The SFM-133-L2-L-D-A-P-TR supports 66 total signal positions in a dual-row configuration at 0.050" (1.27 mm) pitch, providing 33 contacts per row. This pitch is twice as dense as the standard .100" grid, allowing a 66-pin interface to fit in roughly the same board length as a 33-pin .100" connector, which is critical for space-constrained PCB designs in embedded or portable systems.
What does the low-profile (L) designation mean for the SFM-133-L2-L-D-A-P-TR in stacked PCB assemblies?
The low-profile (L) designation on the SFM-133-L2-L-D-A-P-TR means the connector housing height is minimized to reduce the board-to-board stacking distance. In typical mezzanine assemblies this can reduce the inter-board gap by 2 mm or more compared to standard-height socket strips, allowing enclosure designs with overall stack heights below 10 mm while maintaining reliable 66-pin electrical connections.
Can the SFM-133-L2-L-D-A-P-TR replace the SFM-132-02-STL-D-DS in a 64-pin design?
The SFM-133-L2-L-D-A-P-TR has 66 positions while the SFM-132-02-STL-D-DS has 64 positions, both at 0.050" (1.27 mm) pitch. A direct substitution is not pin-compatible due to the 2-position difference; designers would need to verify PCB footprint and signal mapping. If the extra 2 pins can be left unconnected, the SFM-133 may be a functional replacement, but pitch and housing height options (L vs STL) must also be confirmed before substitution.
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