SFM-133-L2-FM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-L2-FM-D-A-K is a 66-position dual-row high-reliability socket strip with 0.050-inch (1.27mm) pitch in a surface-mount package, delivering dense female interconnects for board-to-board stacking in telecommunications, aerospace, and high-speed digital systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-L2-FM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66-position dual-row socket strip at 0.050-inch (1.27mm) pitch enabling ultra-high-density board stacking
- L2 standoff option provides defined board-to-board spacing for reliable mezzanine stack height control
- High-reliability female contacts with gold plating support high mating cycles and low-resistance signal paths in demanding environments
Applications
The SFM-133-L2-FM-D-A-K is ideal for high-density mezzanine stack configurations in network switching cards, FPGA carrier boards, and military avionics modules where 66 positions at 1.27mm pitch are required across a defined board-to-board stack height. Its surface-mount design supports reflow soldering in automated SMT assembly lines for high-volume production of embedded computing and communications hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does the SFM-133-L2-FM-D-A-K have and what is the row spacing?
The SFM-133-L2-FM-D-A-K has 66 positions in a dual-row configuration at 0.050-inch (1.27mm) pitch, providing 33 contacts per row. This high pin density at 1.27mm pitch allows 66 simultaneous connections in a compact surface-mount footprint for mezzanine board stacking applications.
What does the L2 option in SFM-133-L2-FM-D-A-K specify for board-to-board stacking?
The L2 suffix in the SFM-133-L2-FM-D-A-K denotes a specific standoff post length that controls the board-to-board gap in mezzanine stack assemblies. The defined standoff height ensures a consistent spacing between stacked PCBs, typically from 4mm to 15mm depending on the mated male header, preventing mechanical stress on the 66-pin connector interface.
Can the SFM-133-L2-FM-D-A-K be assembled using standard SMT reflow processes?
Yes, the SFM-133-L2-FM-D-A-K is a surface-mount connector compatible with standard lead-free reflow soldering at peak temperatures up to 260°C. The 66-position body is sized for automated pick-and-place feeders, and the SMT pads at 1.27mm pitch are designed for consistent solder joint formation in production environments.
What industries and system types typically use the SFM-133-L2-FM-D-A-K socket strip?
The SFM-133-L2-FM-D-A-K with 66 positions at 0.050-inch pitch and L2 standoff posts is commonly deployed in defense avionics, telecommunications line cards, test and measurement instruments, and high-performance computing modules. Its operating range of -55°C to +125°C and high-reliability design make it suitable for harsh-environment electronics where standard connectors are insufficient.
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