SFM-133-L2-F-D-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC SFM-133-L2-F-D-A-P-TR is a 66-position dual-row high-reliability SMT socket strip at 0.050 inch pitch, engineered for fine-pitch mezzanine and board-to-board interconnect with gold-plated contacts. Features press-fit mounting pegs and tape-and-reel packaging for automated assembly in high-volume production. Available with worldwide stock distribution and fast shipping times.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SFM-133-L2-F-D-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
66
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SFM-133-L2-F-D-A-P-TR?

  • 66-position dual-row SMT socket strip at 0.050 inch (1.27 mm) pitch achieves high signal density in compact mezzanine designs
  • High-reliability gold-plated contacts with long-wipe geometry maintain contact resistance below 20 milliohms over 500+ mating cycles
  • Press-fit mounting peg (P option) increases board attachment strength and prevents connector movement during automated soldering reflow
  • Tape-and-reel (TR) packaging optimizes placement throughput on automated SMT pick-and-place lines for high-volume production runs

What is SFM-133-L2-F-D-A-P-TR used for?

The SFM-133-L2-F-D-A-P-TR is designed for high-density mezzanine card interconnect in FPGA development boards, network switch line cards, and defense electronics modules requiring 66 signal channels at 0.050 inch pitch. Its fine-pitch dual-row socket configuration enables board-to-board signal routing of high-speed differential pairs and parallel data buses in compact mezzanine assemblies. The press-fit mounting peg and gold contact finish ensure reliable performance across -55°C to +125°C temperature ranges and hundreds of insertion cycles in field-replaceable module applications.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the SFM-133-L2-F-D-A-P-TR datasheet?

SFM-133-L2-F-D-A-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SFM-133-L2-F-D-A-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many signal positions does the SFM-133-L2-F-D-A-P-TR provide, and at what pitch are they arranged?

The SFM-133-L2-F-D-A-P-TR provides 66 total positions in a dual-row arrangement with 33 contacts per row at a 0.050 inch (1.27 mm) pitch. This fine pitch allows 66 signal connections to be routed within a board footprint of approximately 43 mm by 5 mm, enabling high channel-count mezzanine designs that would require nearly twice the board length using standard 0.100 inch pitch connectors.

What role does the press-fit mounting peg (P option) play in the SFM-133-L2-F-D-A-P-TR during SMT assembly?

The press-fit mounting peg is a plastic or metal pin that inserts into a corresponding through-hole on the PCB before reflow soldering, physically constraining the 66-position socket during the reflow oven pass where thermal expansion could cause connector shift. This retention prevents pad registration errors in the fine 0.050 inch pitch pattern, which has a pad-to-pad clearance of only 0.635 mm and cannot tolerate the connector movement that board vibration or conveyor handling would otherwise cause.

For which high-speed signal applications is the SFM-133-L2-F-D-A-P-TR well suited at 0.050 inch pitch?

At 0.050 inch pitch with controlled impedance contact geometry, the SFM-133-L2-F-D-A-P-TR supports differential pairs for protocols such as PCIe Gen 1 and Gen 2 at 2.5 Gbps and 5 Gbps per lane, LVDS at frequencies up to several hundred megahertz, and single-ended signals up to 3.3 V logic. FPGA mezzanine modules, GPU accelerator cards, and radar signal processing boards use this socket to route 8-lane or wider data buses between base boards and compute mezzanine modules.

What mating header product from SAMTEC pairs with the SFM-133-L2-F-D-A-P-TR for a complete mezzanine stack?

The SFM-133-L2-F-D-A-P-TR mates with SAMTEC's SFM-series header pins at the same 0.050 inch dual-row pitch, with the L2 suffix indicating the specific mated stack height that determines the board-to-board separation — typically in the 5 mm to 10 mm range. Designers should select the corresponding SFM header with matching L suffix to achieve the required PCB-to-PCB standoff for their application, ensuring a mated engagement depth of at least 2.5 mm for secure 66-position electrical contact.

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Factory-direct from China distributors, low MOQ
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DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
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About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy