SFM-133-L2-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-L2-F-D-A-P-TR is a 66-position dual-row high-reliability SMT socket strip at 0.050 inch pitch, engineered for fine-pitch mezzanine and board-to-board interconnect with gold-plated contacts. Features press-fit mounting pegs and tape-and-reel packaging for automated assembly in high-volume production. Available with worldwide stock distribution and fast shipping times.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-L2-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-133-L2-F-D-A-P-TR?
- 66-position dual-row SMT socket strip at 0.050 inch (1.27 mm) pitch achieves high signal density in compact mezzanine designs
- High-reliability gold-plated contacts with long-wipe geometry maintain contact resistance below 20 milliohms over 500+ mating cycles
- Press-fit mounting peg (P option) increases board attachment strength and prevents connector movement during automated soldering reflow
- Tape-and-reel (TR) packaging optimizes placement throughput on automated SMT pick-and-place lines for high-volume production runs
What is SFM-133-L2-F-D-A-P-TR used for?
The SFM-133-L2-F-D-A-P-TR is designed for high-density mezzanine card interconnect in FPGA development boards, network switch line cards, and defense electronics modules requiring 66 signal channels at 0.050 inch pitch. Its fine-pitch dual-row socket configuration enables board-to-board signal routing of high-speed differential pairs and parallel data buses in compact mezzanine assemblies. The press-fit mounting peg and gold contact finish ensure reliable performance across -55°C to +125°C temperature ranges and hundreds of insertion cycles in field-replaceable module applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-133-L2-F-D-A-P-TR datasheet?
SFM-133-L2-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-133-L2-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-133-L2-F-D-A-P-TR provide, and at what pitch are they arranged?
The SFM-133-L2-F-D-A-P-TR provides 66 total positions in a dual-row arrangement with 33 contacts per row at a 0.050 inch (1.27 mm) pitch. This fine pitch allows 66 signal connections to be routed within a board footprint of approximately 43 mm by 5 mm, enabling high channel-count mezzanine designs that would require nearly twice the board length using standard 0.100 inch pitch connectors.
What role does the press-fit mounting peg (P option) play in the SFM-133-L2-F-D-A-P-TR during SMT assembly?
The press-fit mounting peg is a plastic or metal pin that inserts into a corresponding through-hole on the PCB before reflow soldering, physically constraining the 66-position socket during the reflow oven pass where thermal expansion could cause connector shift. This retention prevents pad registration errors in the fine 0.050 inch pitch pattern, which has a pad-to-pad clearance of only 0.635 mm and cannot tolerate the connector movement that board vibration or conveyor handling would otherwise cause.
For which high-speed signal applications is the SFM-133-L2-F-D-A-P-TR well suited at 0.050 inch pitch?
At 0.050 inch pitch with controlled impedance contact geometry, the SFM-133-L2-F-D-A-P-TR supports differential pairs for protocols such as PCIe Gen 1 and Gen 2 at 2.5 Gbps and 5 Gbps per lane, LVDS at frequencies up to several hundred megahertz, and single-ended signals up to 3.3 V logic. FPGA mezzanine modules, GPU accelerator cards, and radar signal processing boards use this socket to route 8-lane or wider data buses between base boards and compute mezzanine modules.
What mating header product from SAMTEC pairs with the SFM-133-L2-F-D-A-P-TR for a complete mezzanine stack?
The SFM-133-L2-F-D-A-P-TR mates with SAMTEC's SFM-series header pins at the same 0.050 inch dual-row pitch, with the L2 suffix indicating the specific mated stack height that determines the board-to-board separation — typically in the 5 mm to 10 mm range. Designers should select the corresponding SFM header with matching L suffix to achieve the required PCB-to-PCB standoff for their application, ensuring a mated engagement depth of at least 2.5 mm for secure 66-position electrical contact.
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