SFM-133-02-LM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-02-LM-D-A-P-TR is a 66-position dual-row high-reliability surface mount socket strip with 0.050-inch (1.27 mm) pitch for dense mezzanine and daughter card interfaces. Tape-and-reel packaging enables automated SMT production. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-02-LM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66 positions in a dual-row surface mount configuration at 0.050-inch (1.27 mm) pitch for high-density mezzanine and daughter card socket interfaces
- High-reliability contact design rated for multiple mating cycles, suitable for hot-swappable or frequently removed modules in computing and telecom systems
- Tape-and-reel (-TR) packaging with peel-and-stick protection for automated pick-and-place placement in volume SMT manufacturing
Applications
The SFM-133-02-LM-D-A-P-TR is designed for high-density board stacking and mezzanine card interfaces in network switches, FPGA development boards, and high-performance computing modules requiring 66 dual-row socket positions at 0.050-inch pitch. Its high-reliability socket construction supports repeated module insertions in systems with field-replaceable daughter cards or expansion modules. The SMT footprint integrates into standard reflow soldering assembly processes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contact positions does the SFM-133-02-LM-D-A-P-TR provide and at what pitch?
The SFM-133-02-LM-D-A-P-TR provides 66 positions arranged in a dual-row configuration at 0.050-inch (1.27 mm) pitch, yielding a total of 132 individual contacts in a compact SMT socket strip footprint suitable for high-density board stacking applications.
In a network switch or FPGA expansion design, what advantage does the SFM-133-02-LM-D-A-P-TR offer over a 0.100-inch pitch socket?
At 0.050-inch (1.27 mm) pitch, the SFM-133-02-LM-D-A-P-TR fits 66 positions in approximately half the linear board space required by a standard 0.100-inch pitch connector, enabling higher channel density per unit PCB area in network switch line cards, FPGA mezzanine sockets, and high-performance computing modules.
How does the high-reliability construction of the SFM-133-02-LM-D-A-P-TR support hot-swap or field-replacement scenarios?
The high-reliability socket contact design of the SFM-133-02-LM-D-A-P-TR is engineered to maintain stable electrical contact resistance across repeated insertion and withdrawal cycles, making it suitable for daughter cards or expansion modules that are frequently replaced in the field without degrading the 66-position 0.050-inch pitch interface.
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