SFM-133-02-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-133-02-H-D-A-P-TR is a 66-position dual-row high-reliability socket strip with 1.27mm (0.050 inch) pitch in a surface-mount package, engineered for dense signal routing in space-critical SMT board designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- SFM-133-02-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 66 positions in a dual-row 1.27mm pitch layout for ultra-high-density SMT signal interconnection
- High-reliability socket construction with gold-plated contacts ensuring low contact resistance over extended mating cycles
- Tape-and-reel packaging supporting automated pick-and-place assembly in high-volume production
Applications
The SFM-133-02-H-D-A-P-TR is designed for high-density mezzanine board connections in embedded computing, FPGA carrier boards, and ruggedized military or aerospace systems where 1.27mm pitch enables maximizing I/O count within a minimal PCB footprint. Its high-reliability rating makes it suitable for applications requiring consistent electrical performance over thousands of mating cycles and across a wide operating temperature range. Tape-and-reel delivery further streamlines integration into automated SMT manufacturing workflows.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count define the SFM-133-02-H-D-A-P-TR connector?
The SFM-133-02-H-D-A-P-TR provides 66 positions arranged in a dual-row configuration on a 1.27mm (0.050 inch) pitch, enabling very high-density signal routing in surface-mount applications where board space is at a premium.
Which embedded computing and mezzanine designs benefit from the SFM-133-02-H-D-A-P-TR's high-reliability socket?
FPGA mezzanine cards (FMC), PC/104 daughter boards, and high-cycle test fixtures benefit most from this connector's high-reliability socket construction; gold-plated contacts maintain low contact resistance below 20 milliohms across hundreds or thousands of insertion cycles in demanding industrial and defense applications.
How does the 1.27mm pitch of SFM-133-02-H-D-A-P-TR compare to standard 2.54mm connectors for board space savings?
At 1.27mm pitch the SFM-133-02-H-D-A-P-TR occupies roughly half the linear board space of a comparable 2.54mm connector for the same 66-position count, allowing designers to nearly double I/O density or reclaim significant PCB area for other circuitry.
What does tape-and-reel delivery mean for assembly of the SFM-133-02-H-D-A-P-TR in production?
Tape-and-reel packaging means individual connectors are carried in a continuous embossed carrier tape wound on a standard reel, allowing pick-and-place machines to feed and place the 66-pin SMT socket at full automated line speed without manual loading, which dramatically reduces placement time and human error in high-volume PCB assembly.
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