SFM-132-T2-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-132-T2-H-D-A-P-TR is a 64-position dual-row high-reliability surface mount socket strip on 0.050" (1.27mm) pitch with high-profile housing and polarization. Gold-plated contacts and tape-and-reel packaging support automated high-volume PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-T2-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-132-T2-H-D-A-P-TR?
- 64-position dual-row configuration on 0.050" (1.27 mm) pitch with polarization (P) feature to prevent mis-mating in high-density SMT connector systems
- High-profile (H) housing provides additional vertical clearance for board stacking, accommodating mated component heights above the standard 2.54 mm SFM stack dimension
- Gold-plated contacts with high-reliability rating deliver consistent low contact resistance and long mating cycle life exceeding 100 cycles in demanding signal applications
What is SFM-132-T2-H-D-A-P-TR used for?
The SFM-132-T2-H-D-A-P-TR is used in high-density FPGA and processor daughter card connections, test fixture interposers, and communication module stacking applications. With 64 positions at 0.050-inch pitch, it supports wide parallel buses, multi-channel SerDes lanes, and combined power and signal routing in compact mezzanine designs. The polarization feature and tape-and-reel packaging reduce assembly errors and support automated production for telecom and data center hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-132-T2-H-D-A-P-TR datasheet?
SFM-132-T2-H-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-132-T2-H-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal lines can the 64-position SFM-132-T2-H-D-A-P-TR route in a dual-row FPGA daughter card design?
The SFM-132-T2-H-D-A-P-TR provides 64 total positions (32 per row) on a 0.050-inch (1.27 mm) pitch, enabling routing of a 32-bit parallel data bus plus 32 dedicated ground or control signals through a single connector pair. This supports FPGA I/O banks operating at 1.8 V to 3.3 V logic levels in high-speed daughter card interfaces.
What does the polarization (P) option prevent in the SFM-132-T2-H-D-A-P-TR?
The polarization key on the SFM-132-T2-H-D-A-P-TR physically prevents reversed or off-center mating across all 64 contacts. This protects sensitive FPGA I/Os and mixed-voltage signal lines from short circuits or incorrect logic-level connections that would occur if a 1.27 mm pitch connector were inserted one position off during manual board assembly or field replacement.
In which scenarios does the high-profile (H) housing of SFM-132-T2-H-D-A-P-TR offer an advantage over standard-height variants?
The high-profile housing provides additional clearance of approximately 2.54 mm above the PCB surface, accommodating surface mount components or tall decoupling capacitors placed within the board stacking gap. This is valuable in FPGA mezzanine designs where 100 µF or larger bulk capacitors at heights above 3 mm must fit within the mated connector stack envelope.
How does the SFM-132-T2-H-D-A-P-TR compare to a 22-position SFM variant when selecting a connector for a 48-bit bus interface?
For a 48-bit bus requiring at least 48 signal contacts plus ground returns, the 64-position SFM-132-T2-H-D-A-P-TR is the appropriate choice, providing 16 additional contacts for power and ground allocation compared to the minimum requirement. The 22-position SFM-111 would fall short by 26 contacts, requiring multiple connectors and increasing PCB routing complexity at the 1.27 mm pitch signal layer.
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