SFM-132-L2-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-132-L2-ZZ-D-A-K-TR is a 64-position, dual-row, high-reliability socket strip with 0.050" (1.27 mm) pitch and surface mount termination. Features gold-plated contacts and tape-and-reel packaging for automated SMT assembly in high-density board-to-board and mezzanine interconnect applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-L2-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64 positions in dual-row 0.050" (1.27 mm) pitch SMT socket configuration for ultra-high-density board-to-board mating
- High-reliability design with gold-plated contacts (-K) rated for extended mating cycles in critical applications
- Tape-and-reel (-TR) packaging supports automated pick-and-place assembly for high-volume SMT production lines
- Compatible with SAMTEC 0.050" pitch TSM and TSW header series for flexible board stack-up height configurations
Applications
The SFM-132-L2-ZZ-D-A-K-TR is designed for high-density mezzanine board interconnects, FPGA expansion daughter cards, and multi-board stack-up systems requiring 64 signal connections at 0.050" pitch in a compact SMT footprint. Its gold-plated contacts and high-reliability rating make it well-suited for aerospace, defense, medical imaging, and industrial computing applications where connector integrity over thousands of mating cycles is essential. The tape-and-reel packaging enables consistent automated placement in volume SMT production of embedded computing and data acquisition modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What position count and pitch does the SFM-132-L2-ZZ-D-A-K-TR provide for high-density mezzanine applications?
The SFM-132-L2-ZZ-D-A-K-TR provides 64 total positions in a dual-row socket configuration at 0.050" (1.27 mm) pitch, with 32 contacts per row. This ultra-high-density layout enables 64 signal or power connections in a footprint significantly smaller than equivalent 2.54 mm pitch connectors, making it ideal for compact FPGA daughter cards, memory modules, and multi-board stack-up designs.
How does the gold contact plating in the SFM-132-L2-ZZ-D-A-K-TR benefit high-cycle-life mating applications?
The -K suffix specifies gold-plated contacts that maintain contact resistance below 20 mΩ across thousands of insertion and withdrawal cycles. Gold plating prevents oxidation and surface corrosion that would degrade signal quality over time, making the SFM-132-L2-ZZ-D-A-K-TR suitable for high-reliability applications in aerospace, defense electronics, and medical instruments where connector failure in service is not acceptable.
Which SAMTEC header series is compatible with the SFM-132-L2-ZZ-D-A-K-TR socket and what stack heights are achievable?
The SFM-132-L2-ZZ-D-A-K-TR is designed to mate with SAMTEC TSM and TSW series 0.050" pitch dual-row header strips. Depending on the selected header mating length, board stack heights from approximately 8 mm to over 20 mm are achievable, allowing designers to configure the inter-board clearance needed for components on the inner-facing sides of stacked PCBs across all 64 positions.
What does the tape-and-reel (-TR) packaging format of the SFM-132-L2-ZZ-D-A-K-TR enable in SMT production?
Tape-and-reel packaging pre-orients each SFM-132-L2-ZZ-D-A-K-TR connector in a carrier tape with consistent pitch spacing, enabling automated pick-and-place machines to place all 64-position connectors at high speed with repeatable accuracy. This packaging eliminates manual handling, reduces placement defects, and is compatible with standard SMT feeders on all major pick-and-place platforms for volume production runs.
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