SFM-132-L2-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-132-L2-L-D-A-K is a 64-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch designed for surface-mount board-to-board and mezzanine stacking interconnect applications. From $3.20, in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-L2-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64-position dual-row socket with 0.050" (1.27 mm) pitch for very high-density signal routing
- Surface-mount termination for compact PCB footprint and reflow-solderable assembly
- High-reliability gold-plated contacts rated for multiple mating cycles in demanding environments
- L2 stacking height option enabling precise board-to-board standoff in mezzanine system designs
Applications
The SFM-132-L2-L-D-A-K is designed for high-density mezzanine and board-to-board stacking in networking switches, telecommunications equipment, and embedded computing platforms. Its 64-position, 1.27 mm pitch surface-mount design provides a large signal count in a compact footprint, making it ideal for FPGA daughter cards, test and measurement modules, and high-speed data acquisition boards. The L2 stacking height option allows engineers to define precise board-to-board spacing in space-critical system designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-132-L2-L-D-A-K have, and what pitch does it use?
The SFM-132-L2-L-D-A-K is a 64-position, dual-row socket strip with a 0.050" (1.27 mm) pitch. This high-density configuration allows 64 signals to be routed across 2 rows in a surface-mount package, supporting compact board-to-board interconnect designs.
What does the L2 designation mean for the SFM-132-L2-L-D-A-K, and how does it affect mezzanine stack height?
The L2 designation specifies the stacking height of the connector, setting a defined board-to-board standoff distance. This allows system designers to control the air gap between PCBs in mezzanine configurations, which is critical for thermal management and mechanical clearance in multi-board assemblies.
What PCB assembly process is compatible with the SFM-132-L2-L-D-A-K, and does it require through-hole tooling?
The SFM-132-L2-L-D-A-K uses surface-mount termination, so it is compatible with standard SMT reflow soldering processes and requires no through-hole drilling. Its 1.27 mm pitch and 64 pins across 2 rows enable high-density placement on standard PCB layouts.
In what types of electronic systems is the SFM-132-L2-L-D-A-K typically used?
This 64-position, 1.27 mm pitch SMT mezzanine socket is commonly deployed in networking line cards, telecommunications base station hardware, FPGA-based computing modules, industrial automation controllers, and aerospace avionics where a high signal count in a compact board-to-board interface is required.
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