SFM-132-L2-FM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-132-L2-FM-D-A-P-TR is a 64-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch, providing high-density board-to-board signal connectivity in a low-profile package. The flush-mount termination and gold-plated contacts ensure consistent impedance and corrosion resistance across many mating cycles. Available in tape-and-reel packaging for automated SMT assembly; in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-L2-FM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-132-L2-FM-D-A-P-TR?
- 64 contacts in dual-row layout on 0.050" (1.27 mm) pitch for high-density signal interconnect with small PCB footprint
- FM (flush-mount) termination provides uniform solder joint height for controlled-impedance high-speed signal paths
- L2 low-profile variant minimizes mated stack height in thin PCB assemblies and space-constrained system designs
- Tape-and-reel delivery enables efficient high-volume automated pick-and-place SMT manufacturing
What is SFM-132-L2-FM-D-A-P-TR used for?
The SFM-132-L2-FM-D-A-P-TR is used in mid-to-high density mezzanine card and daughter-board applications where 64 dual-row signals must be routed at 0.050" pitch within a constrained board area. It is commonly found in FPGA expansion modules, embedded computing carriers, and data acquisition hardware that require reliable high-pin-count interconnects in low-profile stack configurations. The flush-mount termination makes it a preferred choice in high-frequency digital designs operating above 200 MHz.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-132-L2-FM-D-A-P-TR datasheet?
SFM-132-L2-FM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-132-L2-FM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals per row does the SFM-132-L2-FM-D-A-P-TR support, and at what pitch?
The SFM-132-L2-FM-D-A-P-TR has 64 total contacts split into 2 rows of 32 contacts each, with a 0.050" (1.27 mm) pitch between contacts in each row. This allows routing 32 signals per row — suitable for a 32-bit data bus, multiple SPI channels, or a combination of address, data, and control lines in embedded processor expansion designs.
What high-speed design benefit does the FM termination of the SFM-132-L2-FM-D-A-P-TR provide?
The FM (flush-mount) termination on the SFM-132-L2-FM-D-A-P-TR ensures all 64 solder tails terminate at a uniform height, eliminating variations in PCB stub length that can cause reflections at frequencies above 200 MHz. For high-speed digital interfaces such as LVDS at 400 Mbps or parallel buses at 133 MHz, this uniform termination is critical to maintaining eye diagram margins and reducing bit-error rates.
In an FPGA mezzanine card design, why choose the 64-position SFM-132 over the 98-position SFM-149 variant?
The 64-position SFM-132-L2-FM-D-A-P-TR is preferred when the design requires fewer than 65 signal connections and PCB area savings are critical. Its shorter body length of approximately 40 mm (versus ~63 mm for the 98-position SFM-149) frees routing space for power planes and decoupling capacitors on densely packed FPGA mezzanine boards, without sacrificing the 0.050" pitch density advantage.
Does the SFM-132-L2-FM-D-A-P-TR support automated SMT assembly, and how is it packaged?
Yes, the SFM-132-L2-FM-D-A-P-TR comes in tape-and-reel (TR) packaging for direct use with automated pick-and-place SMT equipment. The surface mount form factor is compatible with standard lead-free reflow solder profiles up to 260°C. Tape-and-reel format reduces manual handling, protects the 64 gold-plated contacts from contamination, and enables consistent high-throughput production in volume manufacturing environments.
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