SFM-132-02-F-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-132-02-F-D-A-K is a 64-position dual-row high-reliability socket strip with .050" (1.27mm) pitch in a surface mount package. Designed for fine-pitch high-density board-to-board and module mating with durable female contacts for repeated connection cycles.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-132-02-F-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64-position dual-row .050" (1.27 mm) fine-pitch surface mount socket strip for high-density board-to-board interconnects
- High-reliability female contact design rated for repeated mating cycles with consistent low contact resistance
- Fine .050" pitch enables 64 pins in roughly half the footprint area of equivalent .100" pitch connectors
Applications
The SFM-132-02-F-D-A-K is suited for high-density mezzanine, FPGA mating, and module-to-carrier interconnect applications in telecom, military, and high-performance computing where 64 fine-pitch signals must be routed in a minimal board footprint. Its .050" pitch and high-reliability contact design support demanding signal integrity requirements in backplane and blade server applications where 64-channel parallel buses operate at speeds up to several hundred MHz.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the .050" pitch on the SFM-132-02-F-D-A-K compare to .100" pitch connectors for high-density PCB designs?
The .050" (1.27 mm) pitch of the SFM-132-02-F-D-A-K provides twice the pin density per millimeter compared to standard .100" (2.54 mm) pitch connectors. A 64-position .050" connector occupies roughly the same board length as a 32-position .100" connector, enabling significantly higher signal counts in the same footprint for high-density FPGA I/O and mezzanine card designs.
What does the high-reliability rating on the SFM-132-02-F-D-A-K mean for industrial or defense applications?
The high-reliability designation indicates the SFM-132-02-F-D-A-K is engineered for robust contact performance across many mating cycles — typically rated for 30 or more insertion/withdrawal cycles — with consistent contact resistance below a few milliohms. This makes it suitable for field-replaceable modules in defense, aerospace, and industrial systems where connectors must survive harsh vibration, temperature swings from -55°C to +125°C, and frequent board swaps.
When would an engineer choose the SFM-132-02-F-D-A-K over a lower pin-count connector for a mezzanine card design?
An engineer would select the SFM-132-02-F-D-A-K when the mezzanine card requires 64 or more signal, power, and ground lines between boards, such as a high-channel ADC board, FPGA carrier, or network switch blade. Consolidating these into a single 64-pin .050" pitch socket reduces connector count from two or more smaller connectors, simplifying board routing and lowering total assembly cost on high-volume production runs.
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