SFM-131-T2-STL-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-131-T2-STL-D-A-K is a 62-position dual-row high-reliability socket strip on 0.050-inch (1.27 mm) pitch for surface mount PCB assembly, engineered for dense board-to-board interconnect in demanding signal integrity applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-T2-STL-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position dual-row configuration on 0.050-inch (1.27 mm) pitch delivering maximum circuit density within minimal PCB real estate
- High-reliability socket strip construction with reinforced contact retention for robust mating performance across many insertion cycles
- Surface mount termination enabling seamless reflow solder integration without through-hole drilling, streamlining PCB manufacturing
Applications
The SFM-131-T2-STL-D-A-K is deployed in high-density signal distribution applications including FPGA mezzanine cards, data acquisition daughter modules, and multi-layer embedded computing platforms requiring 62 circuits on a narrow 0.050-inch pitch. Its surface mount format supports direct placement and reflow soldering onto compact PCB layouts where board height and footprint are constrained. The high-reliability socket construction ensures repeatable electrical continuity in instrumentation and communications backplane environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the circuit count and pitch of the SFM-131-T2-STL-D-A-K and how does this compare to 0.100-inch alternatives?
The SFM-131-T2-STL-D-A-K provides 62 positions on a 0.050-inch (1.27 mm) pitch in a dual-row surface mount socket. Compared to 0.100-inch pitch alternatives, it achieves the same 62-circuit count in approximately half the board length, making it preferable for compact FPGA or processor module designs.
In which high-reliability embedded computing scenarios is the SFM-131-T2-STL-D-A-K most appropriate?
The SFM-131-T2-STL-D-A-K is most appropriate for FPGA mezzanine cards, COM Express modules, and multi-channel ADC daughter boards where 62 signal or mixed-voltage lines must mate reliably. Its high-reliability socket design withstands repeated insertions in lab prototype environments operating from -40 °C to +85 °C.
Does the SFM-131-T2-STL-D-A-K support surface mount reflow soldering and what process temperatures apply?
Yes. The SFM-131-T2-STL-D-A-K uses surface mount termination pads fully compatible with lead-free reflow soldering at peak temperatures up to 260 °C per IPC/JEDEC J-STD-020. This eliminates through-hole drilling for 62 contacts and reduces PCB fabrication and assembly costs on SMT production lines.
What mating header series is compatible with the SFM-131-T2-STL-D-A-K, and can it be sourced quickly?
The SFM-131-T2-STL-D-A-K mates with Samtec TSM and SHF series headers on the matching 0.050-inch dual-row pitch. Samtec typically stocks this family with lead times of 1 to 4 weeks, and the socket is available through major global distributors for worldwide shipping to development and production facilities.
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