SFM-131-T2-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-131-T2-LM-D-A-K is a 62-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, featuring low-mid (LM) profile and key polarization to support high-density mezzanine board interconnection with accurate orientation control.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-T2-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-131-T2-LM-D-A-K?
- 62-position dual-row socket strip at 0.050 inch (1.27 mm) pitch delivering high contact density for complex multi-signal board-to-board interconnection in a compact surface-mount form factor
- Key (K) polarization feature physically preventing reversed mating on 62-pin dual-row connectors, eliminating risk of signal miswiring in complex multi-board assemblies
- Low-mid (LM) profile surface-mount design balancing board-to-board standoff height with structural rigidity for mezzanine and daughter card interconnect applications
What is SFM-131-T2-LM-D-A-K used for?
The SFM-131-T2-LM-D-A-K is used in high-density mezzanine module and daughter card interconnection in FPGA development boards, embedded computing carriers, and high-speed data acquisition systems that require 62 contacts at 0.050 inch pitch. Its keyed housing ensures correct mating orientation in complex multi-board systems where multiple identical connectors are present. The low-mid profile height provides adequate mechanical stability while supporting controlled board-to-board spacing for signal integrity in high-frequency digital applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-131-T2-LM-D-A-K datasheet?
SFM-131-T2-LM-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-131-T2-LM-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact density advantage does the SFM-131-T2-LM-D-A-K offer over standard 0.100 inch pitch 62-pin alternatives?
At 0.050 inch (1.27 mm) pitch, the SFM-131-T2-LM-D-A-K achieves 62 contacts in approximately half the linear board length that an equivalent 62-position 0.100 inch pitch connector would require. For FPGA daughter cards or high-density embedded computing modules where the board edge length is constrained to less than 2 inches, the 0.050 inch pitch design can accommodate 62 signal and power contacts where only 31 positions would fit at 0.100 inch pitch.
How does key polarization on the SFM-131-T2-LM-D-A-K prevent wiring errors in multi-board assemblies?
The key (K) polarization feature provides a mechanical asymmetry in the connector housing, such as an off-center slot or protrusion, that only allows the matching mated connector to engage in the correct orientation. On a 62-position dual-row 0.050 inch pitch connector, reversing the mating direction by even one pin position would shift all 62 signals by 2 contacts, making this polarization critical to preventing incorrect power or data connections in embedded computing and FPGA system assemblies.
What does the low-mid (LM) profile designation mean for board-to-board stack height with the SFM-131-T2-LM-D-A-K?
The low-mid (LM) profile designation indicates an intermediate housing height between SAMTEC's low (L) and mid (M) profile options, typically providing a board-to-board mated stack height of several millimeters. This intermediate height supports enough mechanical clearance between boards for component clearance on the mating PCB while keeping the overall two-board assembly thinner than a standard full-height socket, making it suitable for compact chassis designs with tight vertical board spacing constraints.
Which embedded or FPGA carrier board designs are most likely to specify the SFM-131-T2-LM-D-A-K?
FPGA-based data acquisition boards, high-speed interface mezzanine cards, and COM Express or SMARC carrier boards that need to pass 62 differential pairs or parallel bus signals across a module-to-carrier boundary are the primary applications. The 62-position count at 0.050 inch pitch provides enough contacts for a 32-bit parallel interface plus power, ground, and control signals, or for multiple high-speed serial lanes with associated power and reference signals, all within a compact dual-row SMT footprint.
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