SFM-131-T2-F-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-131-T2-F-D-LC-TR is a 62-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch, offering high-reliability mating in a compact SMT footprint for high-density board-to-board and mezzanine interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-T2-F-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-131-T2-F-D-LC-TR?
- 62 positions in dual-row configuration for high-density signal routing
- 0.050" (1.27 mm) pitch enabling compact PCB footprint in space-constrained designs
- Surface-mount termination compatible with standard SMT reflow assembly
- High-reliability socket construction with low-cycle-rate mating suitable for permanent interconnects
- Tape-and-reel (TR) packaging for automated pick-and-place assembly
What is SFM-131-T2-F-D-LC-TR used for?
The SFM-131-T2-F-D-LC-TR is designed for high-density board-to-board and mezzanine interconnect applications in telecommunications, networking, and embedded computing systems. Its 62-position dual-row layout at 0.050" pitch provides a compact footprint ideal for FPGA daughter cards, memory modules, and backplane interface boards. The tape-and-reel packaging supports high-volume SMT production lines requiring automated component placement.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-131-T2-F-D-LC-TR datasheet?
SFM-131-T2-F-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-131-T2-F-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many pins does the SFM-131-T2-F-D-LC-TR have and what is its pitch?
The SFM-131-T2-F-D-LC-TR has 62 pins arranged in a dual-row configuration with a 0.050" (1.27 mm) pitch. This compact layout allows 31 contacts per row, enabling high-density signal routing on SMT PCBs.
What mounting style does the SFM-131-T2-F-D-LC-TR use, and how does it fit into SMT production?
The connector uses surface-mount termination and is packaged in tape-and-reel (TR) format, making it directly compatible with automated pick-and-place machines and standard reflow soldering at temperatures up to 260°C. This packaging also reduces per-unit handling time in high-volume production.
What types of board-to-board applications is the SFM-131-T2-F-D-LC-TR designed for?
This 62-position socket strip is designed for mezzanine and board-to-board interconnect applications in systems such as FPGA development boards, networking line cards, and embedded computing modules where 62 signal lines at 0.050" pitch must be reliably connected across two parallel PCB surfaces.
When would the SFM-131-T2-F-D-LC-TR be preferred over a through-hole connector in a similar pin count?
The SMT format of the SFM-131-T2-F-D-LC-TR saves approximately 1.5 mm in board thickness compared to through-hole alternatives, making it preferable in slim enclosures or stacked PCB designs where the 0.050" pitch provides at least 30% higher contact density per unit board area than 0.100" through-hole headers.
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