SFM-131-L2-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-131-L2-L-D-A-P-TR is a 62-position, dual-row, high-reliability surface-mount socket strip with 0.050" (1.27 mm) pitch. Designed for demanding board-to-board interconnect, it features gold-plated contacts and tape-and-reel packaging for automated PCB assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-L2-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-131-L2-L-D-A-P-TR?
- 62-position dual-row configuration at 0.050" (1.27 mm) pitch for very high-density board-to-board signal interfaces
- Surface-mount termination with tape-and-reel (TR) packaging supports high-throughput automated pick-and-place assembly
- High-reliability construction with gold-plated contacts for low contact resistance and extended cycle life
- Compact SMT footprint enables dense multi-layer PCB routing without through-hole barrel interference
What is SFM-131-L2-L-D-A-P-TR used for?
The SFM-131-L2-L-D-A-P-TR serves as the board-to-board interconnect in high-channel-count embedded computing, FPGA carrier cards, and high-speed data acquisition modules. Its 62-pin dual-row 1.27 mm pitch layout provides sufficient contact density for parallel bus, high-speed differential, and mixed-signal interfaces on compact module designs. The tape-and-reel packaging enables seamless integration into high-volume SMT production lines for industrial, telecom, and defense applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-131-L2-L-D-A-P-TR datasheet?
SFM-131-L2-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-131-L2-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal contacts does the SFM-131-L2-L-D-A-P-TR provide, and what is its row pitch?
The SFM-131-L2-L-D-A-P-TR provides 62 total positions arranged in 2 rows at a 0.050" (1.27 mm) pitch, giving designers 31 contacts per row for high-density parallel bus or mixed-signal board-to-board interconnect applications.
Why is the SFM-131-L2-L-D-A-P-TR preferred for FPGA mezzanine card interfaces over lower-density alternatives?
FPGA mezzanine designs often require 40 to 100+ signal lanes for high-speed interfaces such as LVDS or LVCMOS; the SFM-131-L2-L-D-A-P-TR's 62-pin dual-row 1.27 mm pitch format delivers that contact density in a compact surface-mount footprint that mates reliably across the expected 100+ mating cycles in lab and test environments.
What does the tape-and-reel (TR) suffix mean for procurement and assembly planning of the SFM-131-L2-L-D-A-P-TR?
The TR suffix indicates the SFM-131-L2-L-D-A-P-TR is supplied in tape-and-reel format, compatible with 8 mm or wider carrier tape used by automated pick-and-place equipment. This packaging reduces per-unit handling cost, improves placement accuracy, and is required for IPC-compliant SMT assembly lines targeting production volumes of thousands of boards per batch.
How does the SFM-131-L2-L-D-A-P-TR handle mixed signal and power contacts within its 62-position layout?
The SFM-131-L2-L-D-A-P-TR allocates all 62 positions as signal contacts rated for low-current applications; if higher current or power pins are needed alongside signal pins, the designer can assign selected positions to power and ground by using wider PCB copper pours on the corresponding pads, staying within the connector's rated current per pin at its 1.27 mm pitch.
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