SFM-131-02-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-131-02-H-D-A-K is a high-reliability 62-position dual-row surface mount socket strip with 0.050 inch pitch, featuring tall stack height variant H for board-to-board mating in space-constrained but height-flexible electronic assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-02-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position dual-row socket strip at 0.050 inch (1.27 mm) pitch for ultra-high-density surface mount board connections
- H (tall) height variant accommodating greater board-to-board stacking distances compared to standard-height SFM series
- High-reliability SAMTEC construction with robust contact design for multi-cycle mating in harsh environments
Applications
The SFM-131-02-H-D-A-K is used in high-density board-to-board interconnect applications within defense avionics, medical imaging systems, and high-performance computing modules requiring 62 signal connections at 0.050 inch pitch. Its tall H-height designation provides clearance for components between stacked PCBs, making it suitable for multi-board assemblies with through-board components or heat spreaders. The surface mount design supports reflow soldering for automated production of compact, high-reliability electronic systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the H suffix indicate in the SFM-131-02-H-D-A-K part number?
The H suffix in the SFM-131-02-H-D-A-K designates a tall height variant within the SFM series. This extended mating height, compared to standard SFM configurations, provides additional board-to-board clearance for stacked PCB assemblies. Designers select the H variant when components or heat sinks between the 62-position dual-row connected boards require more than the standard stack height.
How many signal lines can the SFM-131-02-H-D-A-K accommodate and at what pitch?
The SFM-131-02-H-D-A-K accommodates 62 signal lines across its dual-row configuration at 0.050 inch (1.27 mm) pitch, with 31 positions per row. This high-density layout allows routing of 62 independent signals in a minimal PCB footprint, making it suitable for FPGA mezzanine cards, memory modules, and multi-channel sensor interfaces requiring compact interconnects.
When would an engineer choose SFM-131-02-H-D-A-K over a lower-position-count SFM variant?
An engineer would select the SFM-131-02-H-D-A-K over lower-count SFM variants when the design requires 62 simultaneous signal connections in a single 0.050 inch pitch dual-row connector rather than multiple smaller connectors. Consolidating into one 62-position connector reduces BOM complexity, minimizes PCB routing congestion, and improves signal integrity by eliminating inter-connector impedance discontinuities in high-speed digital systems.
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