SFM-131-02-F-D-DS SAMTEC Connector (Other) In Stock
SFM-131-02-F-D-DS is a Samtec high-reliability 62-position dual-row socket strip at 0.050 inch pitch with surface-mount termination, gold contact finish, and double-stack (DS) board height option. It provides 31 positions per row for dense board-to-board interconnects. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- SFM-131-02-F-D-DS Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-131-02-F-D-DS?
- 62-position dual-row socket strip at 0.050 inch (1.27 mm) pitch delivering high contact density for compact board-to-board signal connections
- Double-stack (DS) board height configuration providing flexibility to accommodate different mezzanine card standoff heights in multi-board assemblies
- High-reliability design with gold contact finish ensuring low contact resistance below 20 mΩ for consistent signal integrity over many mating cycles
- Surface-mount (SM) termination compatible with standard lead-free reflow soldering processes for automated SMT PCB assembly
What is SFM-131-02-F-D-DS used for?
The SFM-131-02-F-D-DS is designed for high-density mezzanine board connections in FPGA carrier boards, modular embedded computing systems, and telecommunications line cards where 62 signal connections at 0.050 inch pitch are required in a compact surface-mount footprint. Its double-stack height option accommodates various PCB standoffs in multi-board stacking configurations for rack-mount servers and industrial control systems. The high-reliability gold contact finish supports repeated mating cycles in test and measurement fixtures and reconfigurable module-based platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-131-02-F-D-DS datasheet?
SFM-131-02-F-D-DS Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-131-02-F-D-DS?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch, position count, and row configuration of the SFM-131-02-F-D-DS socket strip?
The SFM-131-02-F-D-DS is a 62-position dual-row socket strip with a 0.050 inch (1.27 mm) pitch between contacts, providing 31 positions per row. This high-density pitch is half the spacing of standard 0.100 inch connectors, allowing the SFM-131-02-F-D-DS to deliver 62 signal connections in roughly the same PCB length as a 31-position 0.100 inch connector, significantly improving signal density for compact mezzanine board designs.
What does the DS (double-stack) suffix mean for the SFM-131-02-F-D-DS, and which board stacking heights does it support?
The DS (double-stack) suffix indicates that the SFM-131-02-F-D-DS is designed to accommodate a double board height stacking configuration, allowing mezzanine cards to stack at a greater standoff distance than the single-stack SFM variant. This is useful in designs where the mezzanine board must clear tall components such as heatsinks, transformers, or connectors on the base board, typically supporting board-to-board stacking heights of 8 mm to 15 mm depending on the mating header selection.
How does the SFM-131-02-F-D-DS compare to through-hole dual-row socket strips for high-reliability mezzanine applications?
The surface-mount SFM-131-02-F-D-DS eliminates the need for 62 drilled through-holes per connector, reducing PCB fabrication cost and enabling routing of signal traces on inner layers beneath the connector footprint. The high-reliability gold contact finish maintains contact resistance below 20 mΩ across hundreds of mating cycles, matching or exceeding the performance of many through-hole alternatives while supporting automated SMT assembly at reflow temperatures up to 260°C.
Which embedded computing and FPGA applications benefit most from the SFM-131-02-F-D-DS 62-position socket?
FPGA-based systems such as VITA 57 FMC (FPGA Mezzanine Card) daughter card interfaces, Software Defined Radio (SDR) platforms, and modular industrial controller backplanes benefit from the 62-position SFM-131 series. The 0.050 inch pitch provides sufficient signal density for routing 62 differential pairs or single-ended signals between base and mezzanine cards at data rates up to several gigabits per second, supporting high-speed serial interfaces like PCIe, JESD204B, and LVDS within the Samtec SFM/SHF mating connector system.
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