SFM-130-T2-STL-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-130-T2-STL-D-LC-TR is a 60-position dual-row high reliability surface mount socket strip with 0.050" (1.27 mm) pitch, designed for dense mezzanine and board-to-board interconnect in telecom, industrial, and embedded computing applications. Stacked low-profile construction minimizes stack height while maintaining reliable contact engagement over thousands of mating cycles. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SFM-130-T2-STL-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-130-T2-STL-D-LC-TR?
- 60-position dual-row layout at 0.050" (1.27 mm) pitch for high-density SMT board stacking
- High reliability socket strip rated for thousands of mating cycles with consistent contact force
- Tape-and-reel packaging for automated pick-and-place SMT production efficiency
- Low-profile stacked construction (STL) minimizes overall board stack height in space-constrained designs
What is SFM-130-T2-STL-D-LC-TR used for?
The SFM-130-T2-STL-D-LC-TR is ideal for compact mezzanine board stacking in telecom line cards, FPGA daughter-card assemblies, and industrial module interconnects where 60 signals must be routed in a tight 1.27 mm pitch SMT footprint. Its stacked low-profile design is especially suited for multi-board enclosures where vertical stack height is restricted, such as blade server modules and ruggedized embedded computing chassis. Tape-and-reel packaging supports automated high-throughput PCB assembly for volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-130-T2-STL-D-LC-TR datasheet?
SFM-130-T2-STL-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-130-T2-STL-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signals can SFM-130-T2-STL-D-LC-TR route, and how are they arranged?
The SFM-130-T2-STL-D-LC-TR routes 60 signals total in a dual-row arrangement of 30 contacts per row at a 0.050 inch (1.27 mm) pitch. This compact layout delivers a high signal density within a small PCB footprint, making it suitable for FPGA I/O interfaces, high-speed digital buses, and multi-channel sensor or control signals in mezzanine board designs.
What does the STL designation mean for SFM-130-T2-STL-D-LC-TR, and when is it preferred over standard height variants?
The STL designation indicates a stacked low-profile construction that reduces the overall mated stack height compared to standard SFM variants. This is preferred in multi-board assemblies where the vertical clearance between boards is limited to a few millimeters, such as blade server modules, ruggedized embedded systems, or portable industrial instruments where total PCB stack height must remain under 10 mm.
Can SFM-130-T2-STL-D-LC-TR support reliable connections in a telecom line card undergoing thermal cycling from -40°C to +85°C?
Yes, SAMTEC high reliability socket strips are designed to maintain consistent contact force and low contact resistance across wide temperature ranges including -40°C to +85°C thermal cycling. The gold-plated mating contacts resist oxidation and maintain resistance below 30 milliohms across hundreds of thermal cycles, ensuring signal integrity for high-speed differential pairs and single-ended signals in telecom line card applications.
How does SFM-130-T2-STL-D-LC-TR compare to SFM-131-T2-FM-D-LC-TR for a design needing 60 versus 62 positions?
SFM-130 provides exactly 60 positions while SFM-131 offers 62 positions, both at 1.27 mm pitch in dual-row SMT configurations. If your interface uses exactly 60 signal or power lines, SFM-130-T2-STL-D-LC-TR is the better choice as it avoids 2 unused pins and the STL low-profile construction may offer a shorter stack height advantage over the SFM-131 FM variant in height-constrained enclosures.
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