SFM-130-T2-LM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-130-T2-LM-D-LC-TR is a 60-position dual-row high-reliability SMT socket strip with 1.27 mm (0.050 inch) pitch. It provides 30 positions per row in a low-profile surface-mount configuration, suited for fine-pitch mezzanine and board-to-board interconnects in demanding electronic assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SFM-130-T2-LM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-130-T2-LM-D-LC-TR?
- 60 positions in dual-row 1.27 mm (0.050 inch) pitch layout delivers twice the density of 2.54 mm connectors in the same board footprint
- High-reliability SMT construction with tape-and-reel packaging (TR) supports automated pick-and-place assembly in high-volume production runs
- Low-clearance (LC) option minimizes mated stack height, enabling compact mezzanine board assemblies with vertical clearances below 4 mm
What is SFM-130-T2-LM-D-LC-TR used for?
The SFM-130-T2-LM-D-LC-TR is used in high-density mezzanine and daughter-card assemblies where 1.27 mm pitch board-to-board connections are required in constrained vertical space. Its 60-position dual-row layout suits FPGA evaluation boards, communication modules, and medical imaging equipment requiring reliable fine-pitch SMT interconnects. The tape-and-reel format supports efficient high-volume PCB manufacturing workflows.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-130-T2-LM-D-LC-TR datasheet?
SFM-130-T2-LM-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-130-T2-LM-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-130-T2-LM-D-LC-TR provide?
The SFM-130-T2-LM-D-LC-TR features a 1.27 mm (0.050 inch) pitch with 60 total positions in a dual-row configuration, providing 30 positions per row. This fine pitch allows significantly higher pin density than standard 2.54 mm connectors, fitting into a footprint approximately 38.1 mm long and enabling compact multi-signal interfaces on crowded PCBs.
For which board-to-board stack heights is the LC (low clearance) variant of SFM-130 appropriate?
The LC (low clearance) designation indicates the connector is optimized for mated stack heights below 4 mm, making it suitable for ultra-thin product enclosures and tightly stacked mezzanine modules. In comparison, standard SFM variants accommodate taller mated heights of 6 mm to 11 mm, so the LC variant saves approximately 2 to 7 mm of vertical board space in constrained assemblies.
How does the dual-row 1.27 mm pitch of SFM-130-T2-LM-D-LC-TR compare to single-row alternatives for FPGA daughter cards?
A dual-row 1.27 mm pitch connector like the SFM-130 carries 60 signals in roughly half the board edge length needed by two single-row 2.54 mm connectors carrying the same count. For an FPGA daughter card requiring 60 I/O lines, this reduces connector edge space from approximately 76 mm to 38 mm, freeing PCB area for decoupling capacitors and routing channels adjacent to the FPGA package.
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