SFM-130-T2-FM-D-A-K SAMTEC Connector (Other) In Stock
The SFM-130-T2-FM-D-A-K is a 60-position dual-row high-reliability socket strip from SAMTEC with a 0.050-inch (1.27 mm) pitch in a surface-mount configuration. It offers secure board-to-board mating with robust contact retention and tight mechanical tolerances for demanding electronic assemblies. Available in stock worldwide with competitive pricing for fast procurement.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SFM-130-T2-FM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row socket strip with 0.050-inch (1.27 mm) pitch for high-density board-to-board interconnects
- Surface-mount footprint for reflow-compatible PCB assembly with high reliability contact retention
- SAMTEC high-reliability construction for demanding telecom, industrial, and defense electronic assemblies
Applications
The SFM-130-T2-FM-D-A-K is ideal for high-density board-to-board signal connections in computing, telecommunications, and test equipment where 60 contacts and a 1.27 mm pitch are required. Its surface-mount design suits automated PCB assembly in industrial controls and high-reliability embedded systems that demand consistent low-impedance interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-130-T2-FM-D-A-K socket strip have, and how are they arranged?
The SFM-130-T2-FM-D-A-K has 60 positions arranged in a dual-row configuration, giving 30 contacts per row on a 0.050-inch (1.27 mm) pitch for compact high-density board-to-board signal routing.
What pitch spacing does the SFM-130-T2-FM-D-A-K use for its contacts?
The SFM-130-T2-FM-D-A-K uses a 0.050-inch (1.27 mm) pitch, one of the most widely used fine-pitch socket footprints in high-density board-to-board connector applications for compact PCB layouts.
Is the SFM-130-T2-FM-D-A-K designed for through-hole or surface-mount assembly?
The SFM-130-T2-FM-D-A-K is a surface-mount component, fully compatible with standard SMT reflow processes, enabling automated pick-and-place assembly on high-reliability 60-pin dual-row PCB footprints.
Which system designs benefit most from the SFM-130-T2-FM-D-A-K at a 1.27 mm pitch?
High-density communication backplanes, FPGA mezzanine cards, and test and measurement modules benefit most, as the 60-position dual-row 1.27 mm pitch format allows routing of 60 signals between boards in a minimal footprint.
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