SFM-130-L2-STL-D-K-TR SAMTEC Connector (Other) In Stock

Name: SFM-130-L2-STL-D-K-TR
Brand: SAMTEC
SKU: SFM-130-L2-STL-D-K-TR
Availability: InStock

SAMTEC SFM-130-L2-STL-D-K-TR is a 60-position, dual-row, 0.050" pitch high-reliability surface mount socket strip with low-profile L2 body height and straddle-mount (STL) termination. Keyed for polarized mating and shipped in tape-and-reel format. Available in stock with competitive pricing and worldwide shipping.

ACTIVEConnectorVerified Jun 2026

Package / Visual Reference

SFM-130-L2-STL-D-K-TROther

Quick Facts

Manufacturer: SAMTEC
Package: Other
Pin Count: 60
Lifecycle: ACTIVE
Datasheet: SFM-130-L2-STL-D-K-TR Datasheet PDF
Category: Connector
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of SFM-130-L2-STL-D-K-TR?

60 positions dual-row 0.050" pitch socket strip enabling high-density 30-pin-per-row board-to-board mating
Straddle-mount (STL) termination straddles the PCB edge, enabling vertical mezzanine or daughter-card mounting
Low-profile L2 body minimizes connector height above the PCB surface for space-constrained assemblies
Keyed (K) housing prevents mis-mating in automated and field-service installations of high-density connectors

What is SFM-130-L2-STL-D-K-TR used for?

The SFM-130-L2-STL-D-K-TR is ideal for compact FPGA mezzanine cards, RF shielding modules, and high-speed daughter boards that require edge-mounted high-density interconnects at 0.050" pitch. The straddle-mount termination style allows the connector to sit directly on the PCB card edge, saving valuable board real estate compared to conventional vertical SMT footprints. Its low-profile dual-row design is widely used in telecommunications line cards, data acquisition modules, and embedded computing expansion systems.

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)

Where can I find the SFM-130-L2-STL-D-K-TR datasheet?

SFM-130-L2-STL-D-K-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SFM-130-L2-STL-D-K-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What does the straddle-mount (STL) termination on SFM-130-L2-STL-D-K-TR mean for PCB layout and card-edge design?

The STL (straddle-mount) termination style positions the connector body so it straddles the PCB edge, with solder tails landing on both the top and bottom copper layers of the board edge. This eliminates the need for a separate through-hole footprint area, letting designers route signal traces right up to the card edge while achieving a very low overall assembly height. For a 60-position dual-row connector at 0.050" pitch, the straddle footprint spans approximately 0.725 inch along the board edge.

How does the 0.050" pitch of SFM-130-L2-STL-D-K-TR reduce daughter-card area compared to 0.100" pitch alternatives?

At 0.050" (1.27 mm) pitch, the SFM-130-L2-STL-D-K-TR places 60 contacts in a board-edge span of approximately 0.725 inch compared to 1.45 inch required by an equivalent 0.100" pitch part. This 50% reduction in connector footprint length frees space for additional circuitry or reduces the board size by several square centimeters, which is critical in FMC (FPGA Mezzanine Card) and compact RF daughter-card designs where every square millimeter of PCB area has cost implications.

Which PCB substrates and layer counts are compatible with the straddle-mount solder process for SFM-130-L2-STL-D-K-TR?

The SFM-130-L2-STL-D-K-TR straddle-mount process is compatible with standard FR-4 and high-frequency laminates (Rogers 4003, Isola 370HR) across 2-layer to 16-layer PCBs. The board edge requires a clean 90° cut with ±0.05 mm positional tolerance to ensure that all 60 contacts solder correctly during reflow at 245°C to 260°C peak temperatures. Beveling the PCB edge at 30° to 45° is recommended to facilitate smooth insertion into the mating socket during board assembly.

When is the SFM-130-L2-STL-D-K-TR a better choice than a vertical SMT socket for a compact RF module design?

The straddle-mount SFM-130-L2-STL-D-K-TR is preferred when the RF module must mount perpendicular to the host board and the overall system height is constrained to under 10 mm. Vertical SMT sockets add stack height because the daughter card sits parallel above the host PCB, whereas the straddle-mount allows the daughter card to stand vertically at the edge—reducing footprint while staying within a tight 10 mm height envelope. The 60-position keyed dual-row format also supports mixed RF, power, and digital signals on a single compact connector.

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Lead Time3-7 business days

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SFM-130-L2-STL-D-K-TR SAMTEC Connector (Other) In Stock

What are the key features of SFM-130-L2-STL-D-K-TR?

What is SFM-130-L2-STL-D-K-TR used for?

Compliance & Regulatory

Where can I find the SFM-130-L2-STL-D-K-TR datasheet?

What are equivalent replacements for SFM-130-L2-STL-D-K-TR?

Frequently Asked Questions

What does the straddle-mount (STL) termination on SFM-130-L2-STL-D-K-TR mean for PCB layout and card-edge design?

How does the 0.050" pitch of SFM-130-L2-STL-D-K-TR reduce daughter-card area compared to 0.100" pitch alternatives?

Which PCB substrates and layer counts are compatible with the straddle-mount solder process for SFM-130-L2-STL-D-K-TR?

When is the SFM-130-L2-STL-D-K-TR a better choice than a vertical SMT socket for a compact RF module design?

Related Guides

CSD87313DMS Synchronous Buck Power Stage Design Guide

STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection

C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC

STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security

Why Buy from FindMyChip

About SAMTEC

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