SFM-130-L2-FM-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-130-L2-FM-D-A-K-TR is a 60-position, dual-row, high-reliability socket strip on 1.27 mm (0.050") pitch with female-male contacts, surface mount attachment, and tape-and-reel packaging. Features gold-plated contacts rated from -55°C to +125°C for demanding aerospace and industrial applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SFM-130-L2-FM-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row high-reliability SMT socket strip at 1.27 mm (0.050") pitch providing 120 total contacts for dense mezzanine and daughter card interfaces
- Female-male (FM) contact configuration enables board stacking and signal pass-through arrangements in multi-board system architectures
- Tape-and-reel (TR) packaging with gold-plated contacts rated to -55°C to +125°C for automated production in aerospace and industrial designs
Applications
SFM-130-L2-FM-D-A-K-TR is designed for ultra-high density mezzanine board stacking and daughter card interconnects in aerospace, defense, and high-reliability industrial electronics needing up to 120 signal contacts at 1.27 mm pitch. The female-male configuration makes it ideal for signal pass-through layers in multi-board stacks such as FPGA mezzanine cards, rugged single-board computers, and modular avionics. The tape-and-reel format and gold contacts support both automated SMT production lines and demanding field environments with wide thermal cycling from -55°C to +125°C.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contacts does SFM-130-L2-FM-D-A-K-TR provide at its 1.27 mm pitch?
SFM-130-L2-FM-D-A-K-TR features 30 positions per row in a dual-row layout, delivering 60 total socket positions (120 contact points when counting both FM sides) at 1.27 mm (0.050") pitch. This high-density design supports complex signal interfaces such as high-speed serial buses, FPGA I/O expansion, and mixed-signal backplanes in compact PCB assemblies.
What does the L2 designation indicate for SFM-130-L2-FM-D-A-K-TR mating stack height?
The L2 designation specifies the above-board length of the contacts, directly determining the board-to-board stack height when mated. For the SFM series at 1.27 mm pitch, L2 typically corresponds to a specific stack height in the 2 mm to 8 mm range, allowing designers to select the exact vertical clearance needed for component clearance in compact module stacking configurations.
For which high-reliability environments is SFM-130-L2-FM-D-A-K-TR specifically engineered?
SFM-130-L2-FM-D-A-K-TR is engineered for high-reliability (HR) environments including military avionics, satellite payloads, industrial robotics, and rugged embedded computing systems. Its gold-plated contacts maintain low contact resistance across -55°C to +125°C temperature swings, and the dual-row 1.27 mm pitch construction withstands vibration and mechanical shock levels typical of airborne and ground vehicle applications.
How does SFM-130-L2-FM-D-A-K-TR compare to a 2.54 mm pitch socket strip when integrating a 60-position bus?
At 1.27 mm pitch, SFM-130-L2-FM-D-A-K-TR occupies roughly half the PCB area of a comparable 2.54 mm pitch socket strip for the same 60-position dual-row count. A 30-position row at 1.27 mm spans approximately 38 mm versus 76 mm at 2.54 mm pitch, freeing over 38 mm of board length for additional components or signal routing in dense high-reliability designs.
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