SFM-130-02-STL-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-130-02-STL-D-A-K is a 60-position dual-row high-reliability surface mount socket strip with 0.050" (1.27 mm) pitch. It is designed for very high-density board-to-board interconnects, supporting high-speed signal routing in demanding computing, communications, and instrumentation applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SFM-130-02-STL-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row socket at 0.050" (1.27 mm) pitch offers extremely high contact density for complex board-to-board interfaces
- High-reliability rated construction ensures consistent contact engagement over thousands of mating cycles in harsh environments
- Surface mount termination supports standard SMT reflow processes for repeatable automated PCB assembly
- Dual-row layout accommodates multiple high-speed differential pairs, wide data buses, and mixed power/signal routing in a compact footprint
Applications
The SFM-130-02-STL-D-A-K is suitable for very high pin-count board-to-board interfaces in FPGA mezzanine cards, advanced signal processing modules, and high-channel-count data acquisition systems. Its 60-position dual-row 0.050" pitch design enables wide parallel bus and multi-protocol high-speed signal routing where board area is critically constrained.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum number of differential pairs supported by the SFM-130-02-STL-D-A-K connector?
The SFM-130-02-STL-D-A-K provides 60 positions in a dual-row 0.050" (1.27 mm) pitch layout, supporting up to 30 differential signal pairs. This capacity is sufficient for high-speed interfaces such as multi-lane SERDES, LVDS camera buses, or wide ADC/DAC channels in demanding signal processing and FPGA-based system designs.
Which demanding application environments justify selecting the high-reliability rated SFM-130-02-STL-D-A-K?
The high-reliability rating of the SFM-130-02-STL-D-A-K makes it appropriate for aerospace avionics, industrial robotics controllers, and military-grade signal processing boards where 60-position 0.050" pitch sockets must maintain stable contact resistance and mechanical integrity through thousands of mating cycles and across wide temperature ranges.
How does the SFM-130-02-STL-D-A-K compare to the SFM-123 variant for large-scale signal routing?
The SFM-130-02-STL-D-A-K provides 60 positions versus the SFM-123's 46 positions at the same 0.050" (1.27 mm) dual-row pitch. Designs requiring more than 46 signal lanes — such as wide FPGA I/O banks, high-channel ADC interfaces, or multi-protocol mixed-signal buses — should select the SFM-130 to avoid cascading two separate connectors and the associated routing and alignment complexity.
What PCB assembly processes are compatible with the SFM-130-02-STL-D-A-K surface mount termination?
The surface mount termination of the SFM-130-02-STL-D-A-K is compatible with industry-standard SMT reflow soldering processes using lead-free or leaded solder alloys. All 60 contact positions can be placed and soldered in a single automated pass without through-hole drilling, reducing PCB fabrication cost and supporting high-volume production throughput.
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