SFM-130-02-H-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-130-02-H-D-A-K is a 60-position dual-row 0.050" pitch surface-mount high-reliability socket strip with high-profile (H) standoff and gold-plated contacts rated for 1 A per pin. Designed for mezzanine board-to-board interconnects requiring increased board separation and kinematic locking retention.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- SFM-130-02-H-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row configuration at 0.050" (1.27 mm) pitch supports high signal-density mezzanine interconnects on compact PCBs
- High-profile (H) standoff design provides increased board-to-board separation for components mounted beneath the mezzanine card
- Kinematic (K) locking retention prevents accidental unmating under vibration, maintaining reliable 1 A-rated contact engagement across 200+ mating cycles
Applications
The SFM-130-02-H-D-A-K is designed for high-channel-count mezzanine interconnect applications in industrial control systems, FPGA development platforms, and ruggedized communications hardware where 60 signal lines must be routed between stacked PCBs at 0.050" pitch with clearance for board-mounted components. Its high-profile standoff and kinematic locking make it particularly suitable for designs subject to mechanical vibration or requiring component access between mezzanine layers.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the high-profile (H) standoff option provide for the SFM-130-02-H-D-A-K compared to standard-height variants?
The high-profile (H) standoff option increases the board-to-board separation distance in the mated connector pair, creating additional clearance between the carrier board and the mezzanine card. This allows taller components such as capacitors, inductors, or heat sinks up to several millimeters in height to be mounted on the carrier board beneath the mezzanine layer without physical interference.
Can SFM-130-02-H-D-A-K be assembled using standard SMT processes, and what reflow temperature applies?
Yes, the SFM-130-02-H-D-A-K uses surface-mount termination compatible with standard SMT reflow processes up to 260°C peak temperature per IPC/JEDEC J-STD-020. The 60-position dual-row 0.050" pitch footprint requires a precision solder paste stencil to ensure consistent solder volume across all 60 pads during reflow assembly.
How does the kinematic (K) retention in SFM-130-02-H-D-A-K benefit ruggedized industrial applications?
The kinematic locking system secures the mated connector pair against forces from vibration and shock loads commonly encountered in industrial automation and transportation electronics, ensuring all 60 gold-plated contacts remain fully engaged. This eliminates the need for secondary mechanical fasteners and maintains signal continuity at 1 A per pin across 200+ mating cycles, reducing field failure risk in harsh-environment deployments.
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