SFM-129-T2-L-D-A-P-TR SAMTEC Connector (Other) In Stock
Samtec SFM-129-T2-L-D-A-P-TR is a 58-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, low-profile body, extended solder tail, and polarized mating for high-density board-to-board interconnects. Tape-and-reel packaging supports automated SMT production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- SFM-129-T2-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-129-T2-L-D-A-P-TR?
- 58-position dual-row layout at 0.050" (1.27 mm) pitch provides 29 channels per row in a compact low-profile surface mount package
- Extended solder tail (T2) increases solder joint stand-off for improved joint formation and post-reflow inspection on fine-pitch pads
- Low-profile (L) body minimizes board stack height, ideal for thin mezzanine and module assembly designs
- Polarized (P) keying prevents reverse mating across 58 positions, safeguarding circuit integrity during assembly and field service
What is SFM-129-T2-L-D-A-P-TR used for?
The SFM-129-T2-L-D-A-P-TR is designed for high-density mezzanine and daughter card interconnects in networking line cards, FPGA evaluation modules, and embedded computing carrier boards. Its 58-position dual-row configuration at 1.27 mm pitch consolidates a large number of signals into a single low-profile surface mount socket, reducing component count and board area. The polarized, extended-tail design ensures correct orientation and reliable solder joints in automated production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-129-T2-L-D-A-P-TR datasheet?
SFM-129-T2-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-129-T2-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile body of the SFM-129-T2-L-D-A-P-TR affect board stack height in mezzanine assemblies?
The low-profile (L) body variant of the SFM-129-T2-L-D-A-P-TR has a reduced standing height above the PCB compared to standard SFM connectors, directly lowering the board-to-board clearance needed in mezzanine assemblies. For applications such as FPGA daughter cards or compact networking modules, this allows the overall assembly height to be decreased, enabling tighter packaging within enclosures with constrained vertical space.
For a 58-signal interface, why would a designer select the SFM-129-T2-L-D-A-P-TR over two separate 29-position connectors?
Using a single 58-position SFM-129-T2-L-D-A-P-TR reduces PCB footprint compared to two separate 29-position connectors by eliminating the gap and keep-out zones between them. A single connector also simplifies the mating operation, provides a unified polarization point for all 58 positions at 1.27 mm pitch, and reduces BOM complexity — all advantages in high-volume automated SMT production environments.
What role does the T2 extended solder tail play in production quality for the SFM-129-T2-L-D-A-P-TR?
The T2 extended solder tail provides a longer termination length, which increases the solder paste contact area at each of the 58 positions on the 1.27 mm pitch footprint. This improves solder joint formation during reflow, reduces the risk of open joints on fine-pitch pads, and makes post-reflow AOI or X-ray inspection easier because the taller solder fillet is more visible to inspection equipment.
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