SFM-129-L2-STL-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-129-L2-STL-D-A-P-TR is a 58-position, dual-row, 0.050" pitch high-reliability socket strip for surface mount PCB assemblies. Gold-plated contacts and press-fit retention deliver stable signal integrity for dense mezzanine card and board-to-board interconnect designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-129-L2-STL-D-A-P-TR?
- 58-position dual-row socket at 0.050" (1.27 mm) pitch providing 29 contacts per row for high-density SMT interconnects
- Gold-plated (A) contacts ensuring low contact resistance and corrosion resistance for long service life
- Press-fit retention (P) clips hold the connector in place during reflow soldering at up to 260°C without adhesive
- Tape-and-reel (TR) packaging optimized for automated pick-and-place in high-volume SMT production lines
What is SFM-129-L2-STL-D-A-P-TR used for?
The SFM-129-L2-STL-D-A-P-TR is designed for high-density board-to-board and mezzanine interconnect applications in telecommunications, industrial control systems, and embedded computing platforms. With 29 contacts per row at 0.050" pitch, it is well-suited for FPGA expansion cards, backplane daughtercard assemblies, and modular test equipment requiring 58-pin signal interfaces in a compact surface mount package.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-129-L2-STL-D-A-P-TR datasheet?
SFM-129-L2-STL-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-129-L2-STL-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many pins per row does the SFM-129-L2-STL-D-A-P-TR provide, and what is its contact pitch?
The SFM-129-L2-STL-D-A-P-TR offers 29 pins per row across 2 rows for a total of 58 positions, with a 0.050" (1.27 mm) center-to-center contact pitch. This compact pitch allows integration of 58 signals into a small SMT footprint, making it effective for FPGA I/O expansion and parallel bus interfaces on space-constrained PCBs.
How does the STL lead style of the SFM-129-L2-STL-D-A-P-TR differ from other SFM lead options?
The STL suffix denotes a straight lead termination style on the SFM-129-L2-STL-D-A-P-TR, meaning contacts extend straight down for surface mount soldering to PCB pads. Alternative SFM lead styles may include formed or offset leads for specific coplanarity requirements; the STL option provides a flat, consistent solder standoff suited to standard SMT reflow processes at up to 260°C across all 58 positions.
In which signal interface applications is the SFM-129-L2-STL-D-A-P-TR commonly deployed?
The SFM-129-L2-STL-D-A-P-TR is commonly used in FPGA mezzanine card (FMC) designs, 58-bit parallel data bus backplanes, and modular industrial controller expansion slots. Its 58-position, 0.050"-pitch dual-row layout fits applications in telecom line cards, radar signal processing boards, and scientific instrument platforms where medium-density 29-pin-per-row signal distribution is required in a compact SMT socket.
What is the advantage of using press-fit retention on the SFM-129-L2-STL-D-A-P-TR during PCB assembly?
Press-fit retention (P suffix) on the SFM-129-L2-STL-D-A-P-TR mechanically locks the connector to the PCB surface prior to reflow soldering, preventing movement or lifting across all 58 contacts during the soldering process. This eliminates the need for adhesive or manual fixturing, reduces misalignment defects in high-speed SMT lines, and ensures consistent solder joint quality on all 0.050"-pitch positions.
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