SFM-129-L2-L-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-129-L2-L-D-LC-TR is a 58-position dual-row surface mount high-reliability socket strip with 0.050" (1.27 mm) pitch, low-profile construction for precision board-to-board mezzanine interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- SFM-129-L2-L-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 58-position dual-row layout with 0.050" (1.27 mm) pitch delivering high contact density in a compact SMT footprint
- High-reliability socket construction rated for repeated mate/unmate cycles in demanding environments
- Low-clearance (LC) design minimizes stack height for space-constrained mezzanine card assemblies
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly in high-volume production
Applications
SFM-129-L2-L-D-LC-TR serves high-density board-to-board interconnect needs in telecommunications equipment, server mezzanine modules, and defense electronics. The 58-position dual-row 1.27 mm pitch socket is particularly suited to FPGA daughter card interfaces and high-speed signal routing applications requiring reliable low-profile connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-129-L2-L-D-LC-TR socket support and what is its pitch?
The SFM-129-L2-L-D-LC-TR provides 58 positions in a dual-row arrangement with a 0.050" (1.27 mm) pitch, giving 29 contacts per row. This fine pitch allows high-density signal routing on compact PCBs, making it well suited for mezzanine card and FPGA expansion module applications.
What does the low-clearance (LC) designation mean for SFM-129-L2-L-D-LC-TR board stack-up height?
The LC (low-clearance) designation means the connector is designed to minimize the mated stack height between two boards. This reduces overall assembly height compared to standard socket strips, enabling tighter board-to-board spacing typically in the range of a few millimeters, which is critical for compact server blades and embedded computing enclosures.
Is SFM-129-L2-L-D-LC-TR suitable for high-reliability applications such as industrial or defense electronics?
Yes, the SFM-129-L2-L-D-LC-TR is built to SAMTEC high-reliability standards, supporting repeated mate/unmate cycles across a broad operating temperature range of -55°C to +125°C. Its robust construction and 1.27 mm pitch make it appropriate for defense, aerospace, and industrial control equipment where connector failure is not acceptable.
How does SFM-129-L2-L-D-LC-TR compare to SFM-130-L2-FM-D-LC-TR in contact count?
SFM-129-L2-L-D-LC-TR has 58 contacts versus 60 contacts on the SFM-130-L2-FM-D-LC-TR, a difference of 2 positions. Both share the same 0.050" (1.27 mm) pitch and dual-row high-reliability LC series format, so designers can choose between these options based on the required I/O count for their specific FPGA or mezzanine card pinout.
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