SFM-129-02-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-129-02-F-D-A-P-TR is a 58-position dual-row high-reliability surface-mount socket strip with 0.050 inch pitch, gold-plated contacts, and tape-and-reel packaging. From $5.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 58
- Lifecycle
- ACTIVE
- Datasheet
- SFM-129-02-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-129-02-F-D-A-P-TR?
- 58-position dual-row surface-mount socket at 0.050 inch (1.27 mm) pitch for high-density board-to-board or mezzanine interconnects
- Gold-plated contact finish (A suffix) delivering low contact resistance under 20 mΩ and reliable performance over 500+ mating cycles
- Tape-and-reel (TR) packaging compatible with automated SMT pick-and-place assembly and reflow soldering up to 260°C peak
What is SFM-129-02-F-D-A-P-TR used for?
The SAMTEC SFM-129-02-F-D-A-P-TR is designed for high-density mezzanine stacking, FPGA expansion boards, and multi-channel data acquisition modules requiring 58 signal connections at 0.050 inch pitch. Its gold-plated dual-row contacts support high-speed differential signal pairs and power distribution in compact embedded computing platforms. The tape-and-reel format streamlines automated SMT assembly in volume production of telecommunications, medical imaging, and industrial control hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-129-02-F-D-A-P-TR datasheet?
SFM-129-02-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-129-02-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal contacts does the SFM-129-02-F-D-A-P-TR provide and at what pitch?
The SFM-129-02-F-D-A-P-TR provides 58 positions total in a dual-row arrangement at 0.050 inch (1.27 mm) pitch, yielding 29 contacts per row. This high-density layout supports simultaneous routing of data buses, power rails, and ground connections in compact FPGA modules and embedded computing carrier boards.
What contact finish does the SFM-129-02-F-D-A-P-TR use and how does it affect signal integrity?
The SFM-129-02-F-D-A-P-TR uses gold (Au) plated contacts indicated by the A suffix, providing initial contact resistance typically below 20 mΩ. Gold plating resists oxidation and corrosion, maintaining stable impedance over 500 or more mating cycles, which is critical for high-speed differential signals operating at frequencies above 1 GHz in modern embedded systems.
Which PCB assembly process is recommended for the SFM-129-02-F-D-A-P-TR surface-mount socket?
The SFM-129-02-F-D-A-P-TR is designed for automated SMT reflow soldering with a peak reflow temperature of 260°C, compatible with SAC305 lead-free solder alloy. Its tape-and-reel (TR) packaging accommodates standard 8 mm or 12 mm pitch reel formats on pick-and-place machines, enabling high-throughput production of boards with 58-position dual-row socket footprints.
How does the 58-position SFM-129 compare to lower-count SFM variants for FPGA carrier board designs?
The 58-position SFM-129-02-F-D-A-P-TR provides nearly 3 times the signal density of a 20-position SFM variant at the same 0.050 inch pitch, enabling FPGA carrier boards to route wider data buses (up to 32-bit parallel + control lines) across a single dual-row socket. This reduces the number of connectors from 3 to 1, cutting board area and improving signal ground plane continuity for designs operating above 200 MHz.
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