SFM-128-02-F-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-128-02-F-D is a 256-position dual-row surface-mount high-reliability socket strip with 0.050-inch pitch, designed for mating with matching header pins in dense PCB assemblies. Offers straight SMT termination for reflow-compatible soldering processes. Available in stock worldwide with fast global shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Datasheet
- SFM-128-02-F-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 256 positions (128 per row) at 0.050-inch pitch for maximum signal density in surface-mount designs
- High-reliability socket contacts rated for repeated mating cycles with low and consistent contact resistance
- Surface-mount F-style termination fully compatible with standard reflow solder assembly processes
- Dual-row configuration provides mechanical stability and eliminates connector rocking during assembly
Applications
The SFM-128-02-F-D is used in high-density PCB-to-PCB mezzanine stacking assemblies, FPGA evaluation board expansion headers, and test and measurement signal routing boards where 256 reliable surface-mount socket connections are required at 0.050-inch pitch. It suits industrial automation, data acquisition hardware, and communications infrastructure equipment that demands compact, reflow-compatible high-reliability interconnects.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SFM-128-02-F-D provide and how are they arranged across the two rows?
The SFM-128-02-F-D offers 256 total positions arranged in 2 rows of 128 contacts each, spaced at a 0.050-inch (1.27 mm) pitch. This dual-row layout doubles the signal density compared to single-row alternatives of the same body length, making it an efficient choice for FPGA expansion connectors and high-channel-count data acquisition interface boards.
What soldering method is compatible with the SFM-128-02-F-D, and what PCB pad requirements should designers consider?
The SFM-128-02-F-D uses SMT straight termination (F-style) and is designed for standard reflow solder assembly, typically with SAC305 lead-free solder paste at peak temperatures up to 260°C. Designers should follow SAMTEC's recommended PCB land pattern for 0.050-inch pitch dual-row surface-mount connectors, ensuring that paste coverage and stencil thickness are optimized for the fine-pitch pads to achieve consistent solder joint quality across all 256 positions.
What mating connectors are compatible with the SAMTEC SFM-128-02-F-D socket strip?
The SFM-128-02-F-D mates with SAMTEC TFC-128 series and compatible straight-pin or surface-mount header variants on the same 0.050-inch pitch and 128-per-row layout. The socket is designed for repeated mating cycles — SAMTEC rates SFM series connectors for a minimum of 50 mating cycles with retention force maintained throughout. This makes the SFM-128-02-F-D suitable for daughterboard configurations that are occasionally removed for upgrade or repair.
How does the SFM-128-02-F-D compare to lower-density SAMTEC SFM variants when routing signals on a budget?
Choosing the 256-position SFM-128-02-F-D over multiple smaller SFM connectors reduces the total part count, the number of PCB land patterns, and the bill-of-materials cost per signal connection. A single SFM-128-02-F-D handles 256 lines in one footprint, whereas achieving the same count with 16-position SFM connectors would require 16 separate parts and 16 separate placement operations. For production runs above 1,000 units, the consolidated approach also shortens pick-and-place cycle time and reduces reflow-solder paste dispensing complexity.
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