SFM-127-T2-L-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-127-T2-L-D-A-K-TR is a 54-position dual-row surface mount socket strip with 0.050" (1.27 mm) pitch, designed for high-reliability board-to-board and mezzanine connector applications. Features low-profile SMT termination, gold-plated contacts, and dual-row configuration for high-density signal routing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- SFM-127-T2-L-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54-position dual-row SMT socket with 0.050" (1.27 mm) pitch for ultra-high-density signal routing
- Gold-plated contacts with low insertion force design ensuring reliable repeated mating cycles
- Surface mount termination compatible with standard SMT reflow processes for automated assembly
- High-reliability construction rated for rugged industrial and military-grade interconnect applications
Applications
The SFM-127-T2-L-D-A-K-TR is well-suited for high-density board-to-board and mezzanine interconnect designs in telecommunications, data center, and industrial computing equipment. Its compact 0.050" pitch and 54-position dual-row layout make it ideal for FPGA daughter cards, memory module sockets, and test and measurement platforms where space and signal integrity are critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and contact count of the SFM-127-T2-L-D-A-K-TR?
The SFM-127-T2-L-D-A-K-TR features a 0.050" (1.27 mm) pitch with 54 positions arranged in a dual-row configuration, providing 27 contacts per row for high-density SMT interconnect applications.
Which board-to-board applications benefit most from using the SFM-127-T2-L-D-A-K-TR in a mezzanine stack?
This connector excels in FPGA daughter card assemblies, DSP mezzanine boards, and high-speed data acquisition systems where 54 pins at 1.27 mm pitch deliver sufficient signal density within a compact PCB footprint, supporting data rates up to several Gbps with proper layout.
How does the dual-row layout of the SFM-127-T2-L-D-A-K-TR compare to single-row alternatives for dense PCB designs?
The dual-row layout provides 54 positions in the same board length that a single-row version would need for 27 pins, effectively doubling signal density at 1.27 mm pitch. This halves the connector footprint length, saving critical board area in space-constrained industrial and telecom PCB designs.
Is the SFM-127-T2-L-D-A-K-TR compatible with standard SMT reflow soldering processes?
Yes, the SFM-127-T2-L-D-A-K-TR is designed for surface mount technology (SMT) assembly and is fully compatible with standard reflow soldering profiles. The -TR suffix indicates tape-and-reel packaging, enabling automated pick-and-place assembly at high volume with 0.050" (1.27 mm) pitch pads.
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