SFM-127-T2-FM-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-127-T2-FM-D-A-K-TR is a 54-position dual-row high-reliability socket strip with 0.050-inch pitch for surface-mount applications. It features gold-plated contacts for low-resistance mating and supports fine-pitch board-to-board interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- SFM-127-T2-FM-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 54-position dual-row configuration at 0.050 inch (1.27 mm) pitch for high-density SMT interconnects
- Gold-plated contacts providing low contact resistance and extended mating cycle reliability
- Tape-and-reel packaging (TR suffix) for automated pick-and-place PCB assembly
Applications
The SFM-127-T2-FM-D-A-K-TR is used in high-density board-to-board and board-to-module interconnect applications in telecommunications, test and measurement equipment, and industrial computing platforms. Its 0.050-inch pitch dual-row layout allows 54 signal paths in a compact surface-mount footprint, reducing PCB area consumption. The fine-pitch socket design supports mezzanine module connections where signal integrity and mechanical reliability are critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the SFM-127-T2-FM-D-A-K-TR provide?
The SFM-127-T2-FM-D-A-K-TR provides 54 positions arranged in a dual-row configuration at a 0.050-inch (1.27 mm) pitch, enabling high-density signal routing in surface-mount board-to-board and mezzanine applications with minimal PCB footprint.
What board-to-board scenarios benefit most from the SFM-127-T2-FM-D-A-K-TR socket strip's dual-row 0.050-inch pitch layout?
Applications requiring 54 high-speed signals across a compact mezzanine interface benefit most, such as FPGA daughter cards, RF module interconnects, and industrial I/O expansion boards, where 0.050-inch pitch reduces connector width by roughly 40% compared to standard 0.100-inch pitch alternatives.
Does the tape-and-reel (TR) packaging of the SFM-127-T2-FM-D-A-K-TR support high-volume SMT production?
Yes, the TR suffix indicates tape-and-reel packaging compatible with standard pick-and-place equipment, enabling automated SMT assembly at production volumes typically exceeding 1000 pieces per reel and meeting IPC-7711 placement accuracy requirements for fine-pitch connectors.
What contact plating does the SFM-127-T2-FM-D-A-K-TR use, and how does it affect mating cycle performance?
SAMTEC SFM series connectors use gold-plated contacts, which provide a contact resistance below 20 milliohms and are rated for a minimum of 100 mating cycles, ensuring reliable signal continuity in field-replaceable module applications and engineering development platforms.
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