SFM-126-T2-SM-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-126-T2-SM-D-A-K-TR is a 52-position dual-row surface-mount socket strip with 0.050" (1.27 mm) pitch, designed for high-density, high-reliability board-to-board signal interconnects. Gold-plated SMT contacts support automated assembly and low-resistance connections. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- SFM-126-T2-SM-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52-position dual-row layout with 0.050" (1.27 mm) pitch for ultra-high-density board-to-board signal routing
- Surface-mount (SMT) package compatible with automated pick-and-place and reflow soldering processes
- High-reliability gold-plated contacts ensuring stable low-resistance connections across temperature and vibration environments
Applications
The SFM-126-T2-SM-D-A-K-TR is ideal for high-density board-to-board interconnect in server backplanes, telecommunications line cards, and advanced test and measurement platforms. Its 52-position dual-row configuration with 1.27 mm pitch maximizes signal channel density in space-constrained PCB designs. The surface-mount footprint enables high-volume automated assembly for industrial computing and embedded control applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the SFM-126-T2-SM-D-A-K-TR provide and at what pitch?
The SAMTEC SFM-126-T2-SM-D-A-K-TR provides 52 positions in a dual-row configuration with a 0.050 inch (1.27 mm) pitch. This high-density layout allows up to 52 independent signal channels per connector, making it ideal for board-to-board interfaces in data-intensive applications such as FPGA carrier boards and communication backplanes.
For a server backplane needing 52 signal lanes, how does the SFM-126-T2-SM-D-A-K-TR compare to larger-pitch alternatives?
Compared to 2.54 mm pitch connectors, the SFM-126-T2-SM-D-A-K-TR's 1.27 mm pitch nearly halves the connector footprint while maintaining 52 signal positions in a dual-row SMT layout. This compactness reduces PCB area by up to 50% along the connector axis, which is critical in dense server backplane and embedded computing designs requiring high channel counts.
What manufacturing process considerations apply when assembling the SFM-126-T2-SM-D-A-K-TR onto a PCB?
The SFM-126-T2-SM-D-A-K-TR's surface-mount package supports standard reflow soldering at typical lead-free peak temperatures around 260°C. Its SMT footprint is compatible with automated pick-and-place equipment, supporting high-volume production. The 52-position dual-row layout requires precise solder paste application on 1.27 mm pitch pads to ensure reliable connections across all channels.
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