SFM-126-L2-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC SFM-126-L2-L-D-A-K is a 52-position, dual-row, high-reliability surface mount socket strip at 0.050" (1.27 mm) pitch with lead-free gold-plated contacts and low-profile mating height. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 52
- Lifecycle
- ACTIVE
- Datasheet
- SFM-126-L2-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 52 positions in a dual-row 0.050" (1.27 mm) pitch SMD layout for maximum board-to-board connection density
- Low-profile (L) mating height reduces PCB stack height in compact mezzanine and daughter card assemblies
- High-reliability gold-plated contacts engineered for hundreds of mating cycles in industrial and aerospace designs
- L2 lead-length variant provides optimized standoff for controlled impedance and consistent signal performance
Applications
The SFM-126-L2-L-D-A-K is deployed in high-density board-to-board stacking for aerospace, defense, and industrial embedded systems where 52-position dual-row connectivity at 0.050" pitch is needed in a low-profile assembly. Its low mating height makes it suitable for slim mezzanine modules, FPGA daughter cards, and ruggedized backplane interfaces with height constraints. The SMD format supports automated PCB assembly using standard pick-and-place and reflow soldering equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the SFM-126-L2-L-D-A-K provide for board-to-board stacking?
The SFM-126-L2-L-D-A-K provides 52 positions in a dual-row layout at 0.050" (1.27 mm) pitch, delivering high-density board-to-board stacking in roughly half the board length required by a 0.100" pitch connector with the same pin count, ideal for compact aerospace and industrial PCB designs.
How does the low-profile (L) mating height benefit slim PCB stack designs?
The low-profile (L) variant of the SFM-126-L2-L-D-A-K reduces the overall mated stack height compared to standard-height socket strips, enabling slimmer enclosures and tighter board spacing in mezzanine modules and portable embedded systems. This is critical when total PCB stack height must stay under a defined clearance, such as in avionics chassis with 52-pin dual-row interconnects at 0.050" pitch.
In which scenarios would a designer choose SFM-126-L2-L-D-A-K over SFM-124-02-H-D-A-K?
A designer would choose the SFM-126-L2-L-D-A-K over the SFM-124-02-H-D-A-K when 52 positions are needed instead of 48 and when low mating height is required to reduce PCB stack clearance in slim enclosures. Both use 0.050" (1.27 mm) pitch dual-row SMD configurations, but the L2-L variant adds the L2 lead length and low-profile height for height-sensitive aerospace or industrial designs.
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